Patents by Inventor Chia-Ying Yen

Chia-Ying Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-aligned interconnect with protection layer
    Patent number: 12009258
    Abstract: An integrated circuit structure includes a first Inter-Layer Dielectric (ILD), a gate stack in the first ILD, a second ILD over the first ILD, a contact plug in the second ILD, and a dielectric protection layer on opposite sides of, and in contact with, the contact plug. The contact plug and the dielectric protection layer are in the second ILD. A dielectric capping layer is over and in contact with the contact plug.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chan Yen, Ching-Feng Fu, Chia-Ying Lee
  • Electric conductive heat dissipation substrate
    Patent number: 9397279
    Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: July 19, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Cheng-Chou Wong, Chia-Ying Yen, Hsin-Hwa Chen
  • ELECTRIC CONDUCTIVE HEAT DISSIPATION SUBSTRATE
    Publication number: 20150188016
    Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
    Type: Application
    Filed: May 27, 2014
    Publication date: July 2, 2015
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Cheng-Chou Wong, Chia-Ying Yen, Hsin-Hwa Chen
  • Heat sinking element and method of treating a heat sinking element
    Patent number: 8492003
    Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 23, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen
  • HEAT SINKING ELEMENT AND METHOD OF TREATING A HEAT SINKING ELEMENT
    Publication number: 20120125577
    Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
    Type: Application
    Filed: December 30, 2010
    Publication date: May 24, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen