Abstract: A server with an airflow guiding structure includes a chassis having a storage area, a computing area and a fan module installed between the storage area and the computing area. The storage area includes multiple storage modules, and the computing area includes a fan module and a motherboard electrically coupled to each storage module. The fan module has an air inlet configured to be corresponding to the storage area, an air outlet configured to be corresponsive to the computing area and an airflow guiding component with multiple airflow guiding ducts. The airflow guiding component is configured to be corresponsive to the air inlet. Therefore, the vibration of the fan module is reduced and the operation efficiency of the storage medium and the service life of the server are improved.

Abstract: A method of entering data into an electronic device (110, 210) includes touching (902, 912) with continual pressure a touch input region (114). Feedback is received (904, 914, 916, 920, 922) indicating a plurality of input possibilities for selection, wherein the touch is released (906, 924) in response to the feedback (904, 914, 916, 920, 922) in one of a temporal or spatial displacement (918) to select one of the plurality of input possibilities.

Abstract: A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

Abstract: An electronic device (100) for performing intelligent operations includes a housing (112), a manually operable input (118, 122) for providing information to the electronic device, and a material (124) positioned between the manually operable input and the housing. An electromechanical transducer (218, 220) has a mechanical connection consisting of to the manually operable input and an electrical connection for receiving power, wherein substantially all of a mechanical output from the electromechanical transducer is provided to the manually operable input, the material preventing the mechanical output from being transmitted from the manually operable input to the housing.

Abstract: Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mounting and interconnect surface parallel to and spaced from the mounting surface and the plurality of electrical contact areas are spaced a second distance, less than the first distance, from the mounting and interconnect surface. Large solder balls are used between the mounting areas and the mounting and interconnect surface to form a solid mount and smaller solder members are used for electrical interconnections.