Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: Systems and methods for generating a radio frequency (RF) signal by a digital-to-analog converter (DAC) with transmission frequency within a wide transmission frequency range is described. An output reactance of the DAC coupled (directly or indirectly) to one or more antennas corresponds to the transmission frequency of the RF signals. Multiple embodiments of the DAC are described to include circuitry for tuning the output reactance of the DAC, and therefore, shifting a center frequency to select a transmission frequency range (from multiple transmission frequency ranges) for providing the RF signals.

Abstract: The present invention discloses a lead-acid battery electrode plate for preventing lead-acid battery from lead (II) sulfate crystal growth piercing and enhancing the battery formation efficiency. The lead-acid battery electrode plate comprises an electricity collector layer as an electric current channel, and two air permeable layers respectively placed on both sides of the electricity collector layer, wherein non-metallic sheet materials having porous structures are used as air-permeable channel of the air-permeable layers, and the first air-permeable layer is the same as or different from the second air-permeable layer.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract: A method for preparing a flame retardant modified acrylonitrile-based copolymer, includes: prepolymerizing a first composition to obtain a first prepolymer solution including a first prepolymer; prepolymerizing a second composition to obtain a second prepolymer solution including a second prepolymer; and mixing the first and second prepolymer solutions and subjecting a mixture of the first and second prepolymers to polymerization to obtain a flame retardant modified acrylonitrile-based copolymer solution containing a flame retardant modified acrylonitrile-based copolymer.

Abstract: A method for preparing a flame retardant modified acrylonitrile-based copolymer, includes: prepolymerizing a first composition to obtain a first prepolymer solution including a first prepolymer; prepolymerizing a second composition to obtain a second prepolymer solution including a second prepolymer; and mixing the first and second prepolymer solutions and subjecting a mixture of the first and second prepolymers to polymerization to obtain a flame retardant modified acrylonitrile-based copolymer solution containing a flame retardant modified acrylonitrile-based copolymer.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.