Patents by Inventor Chia-Yu Kuo

Chia-Yu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143214
    Abstract: An example method of threshold voltage offset calibration at memory device power up comprises: identifying a set of memory pages that have been programmed within a time window; determining, for each voltage offset bin of a plurality of voltage offset bins, a corresponding value of a data state metric produced by a memory access operation with respect to a memory page of the set of memory pages, wherein the memory access operation utilizes a voltage offset associated with the voltage offset bin; identifying a subset of the plurality of voltage offset bins, such that memory access operations performed using the corresponding voltage offsets produced respective values of the data state metric that satisfy a predefined quality criterion; selecting, among the subset of the plurality of voltage offset bins, a voltage offset bin that is associated with the lowest voltage offset; and associating the set of memory pages with the selected voltage offset bin.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Steven Michael Kientz, Chia-Yu Kuo
  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Patent number: 11922041
    Abstract: An example method of threshold voltage offset calibration at memory device power up comprises: identifying a set of memory pages that have been programmed within a time window; determining, for each voltage offset bin of a plurality of voltage offset bins, a corresponding value of a data state metric produced by a memory access operation with respect to a memory page of the set of memory pages, wherein the memory access operation utilizes a voltage offset associated with the voltage offset bin; identifying a subset of the plurality of voltage offset bins, such that memory access operations performed using the corresponding voltage offsets produced respective values of the data state metric that satisfy a predefined quality criterion; selecting, among the subset of the plurality of voltage offset bins, a voltage offset bin that is associated with the lowest voltage offset; and associating the set of memory pages with the selected voltage offset bin.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: March 5, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Steven Michael Kientz, Chia-Yu Kuo
  • Patent number: 11791300
    Abstract: An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: October 17, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son Tsai, Yih-Jenn Jiang
  • Publication number: 20220189900
    Abstract: An electronic package is provided and includes at least one conductor with a relatively large width formed on an electrode pad of an electronic element and in contact with a circuit layer. As such, when the electronic element and the circuit layer deviate in position relative to one another, the circuit layer will be still in contact with the conductor and hence electrically connected to the electronic element.
    Type: Application
    Filed: February 9, 2021
    Publication date: June 16, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chia-Yu Kuo, Rui-Feng Tai, Yih-Jenn Jiang, Don-Son Jiang, Chang-Fu Lin
  • Publication number: 20220148996
    Abstract: An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.
    Type: Application
    Filed: December 28, 2020
    Publication date: May 12, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son Tsai, Yih-Jenn Jiang
  • Patent number: 10987303
    Abstract: The present disclosure relates generally to depot formulations of lurasidone and methods of making depot formulations of lurasidone. The depot formulations include a suspending agent and are highly syringeable.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: April 27, 2021
    Assignee: LifeMax Laboratories, Inc.
    Inventors: Chung-Chiang Hsu, Tzu-Ying Wu, Wei-Hsiang Wang, Chia-Yu Kuo
  • Publication number: 20190336439
    Abstract: The present disclosure relates generally to depot formulations of lurasidone and methods of making depot formulations of lurasidone. The depot formulations include a suspending agent and are highly syringeable.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 7, 2019
    Inventors: Chung-Chiang Hsu, Tzu-Ying WU, Wei-Hsiang Wang, Chia-Yu Kuo