Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: A subscriber identity module having function of radio frequency identification (RFID) reader includes a card slot, a base, an identification module, an identification chip, and a plurality of reader pads. The card slot has a plurality of phone pins and a plurality of reader pins. The base is disposed in the card slot and has a first accommodating area and a second accommodating area. The identification module is disposed in the first accommodating area and is electrically connected to the phone pins. The identification chip is disposed in the second accommodating area. The reader pads are disposed on the base and are adjacent to the identification chip, and the reader pads are electrically connected to the identification chip and the phone pads.

Abstract: A subscriber identity module includes a base, an identification unit and an identification chip. The base has a first accommodating area and a second accommodating area. The identification unit is configured in the first area, and the identification unit is exposed on a first surface of the base. The identification chip is configured in the second accommodating area and between the first surface and the second surface of the base, wherein the first surface is opposite to the second surface.

Abstract: Treatments of trichomonas, propionibacterium, or yeast infection using an epinecidin-1 peptide or an anti-lipopolysaccharide factor peptide.

Abstract: Treatments of trichomonas, propionibacterium, or yeast infection using an epinecidin-1 peptide or an anti-lipopolysaccharide factor peptide.