Patents by Inventor Chia-Yu Su

Chia-Yu Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186373
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Application
    Filed: February 7, 2024
    Publication date: June 6, 2024
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Publication number: 20240182141
    Abstract: A multihull module is provided. The multihull module includes multiple power floats, an actuation interface controller, and a vehicle controller. The power floats are disposed on a vehicle. The actuation interface controller is coupled to the power floats, and is configured to control the power floats. The vehicle controller is coupled to the actuation interface controller, and is configured to provide a control signal to the actuation interface controller. The actuation interface controller controls the power floats according to the control signal.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 6, 2024
    Applicant: Metal Industries Research & Development Centre
    Inventors: Kuang-Shine Yang, Chao Chieh Hsu, Ping-Hua Su, Tsung-Yi Lan, Chia-Yu Hung
  • Patent number: 11996484
    Abstract: A semiconductor device includes a substrate, two source/drain features over the substrate, channel layers connecting the two source/drain features, and a gate structure wrapping around each of the channel layers. Each of the two source/drain features include a first epitaxial layer, a second epitaxial layer over the first epitaxial layer, and a third epitaxial layer on inner surfaces of the second epitaxial layer. The channel layers directly interface with the second epitaxial layers and are separated from the third epitaxial layers by the second epitaxial layers. The first epitaxial layers include a first semiconductor material with a first dopant. The second epitaxial layers include the first semiconductor material with a second dopant. The second dopant has a higher mobility than the first dopant.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Hao Lin, Chih-Hsuan Chen, Chia-Hao Pao, Chih-Chuan Yang, Chih-Yu Hsu, Hsin-Wen Su, Chia-Wei Chen
  • Publication number: 20240139417
    Abstract: The application describes syringe carriers for medicament delivery devices such as autoinjectors. In particular, a medicament delivery device sub-assembly is described. The medicament delivery device sub-assembly has a housing extending along a longitudinal axis from a proximal end to a distal end, the housing has a tubular section with an internal surface facing towards the axis and an external surface facing away from the axis, wherein the housing has an aperture extending through the tubular section from the internal surface to the external surface; and a housing cover assembly attached in the aperture of the housing, the housing cover assembly being configured to secure a syringe in place relative to the housing.
    Type: Application
    Filed: February 4, 2022
    Publication date: May 2, 2024
    Inventors: Chia-Hsin Su, Nurettin Ali, Antonio Farieta, Meng-Jhen Chiou, Pei Yu Chao, Jason Mondro
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Publication number: 20240125771
    Abstract: The present invention relates to a reaction platform, which comprises: a machine body with a bottom plate for placing non-porous substrates; and a coater module configured on the top of the machine body and capable of maintaining a preset of a predetermined height for moving along the surface of non-porous substrate, wherein the coater module has one or more slits, and a target liquid can be directly injected or sucking in from the outside of the coater module through the slit, and spreading the target liquid onto a surface of the non-porous substrate while moving along the non-porous substrate; wherein the surface of the non-porous substrate has a target to be coated. The reaction platform of the present invention can not only save time, labor and cost, but also have accurate and reproducible experimental results, showing better results than traditional methods.
    Type: Application
    Filed: July 25, 2023
    Publication date: April 18, 2024
    Inventors: An-Bang Wang, Shih-Yu Chen, Tung-Hung Su, Chia-Chi Chu, Chia-Chien Yen, Yu-Wei Chiang
  • Patent number: 11923409
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Publication number: 20230372331
    Abstract: A pharmaceutical composition is provided. The pharmaceutical composition comprises an active pharmaceutical ingredient (API), a polymer and a solvent. The API comprises cariprazine, a pharmaceutically acceptable salt of cariprazine, or a mixture thereof. The polymer comprises poly(lactic acid) (PLA), poly(lactide-co-glycolide) (PLGA), poly(glycolic acid) (PGA), or a combination thereof. A method for preparing the pharmaceutical composition is also provided.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 23, 2023
    Applicant: ANXO PHARMACEUTICAL CO., LTD.
    Inventors: Chia-Yu SU, Hua-Jing JHAN, I Hsiang LIU, Chiung Hui HUNG, Tse-Hsien CHEN, Chi-Heng JIAN
  • Publication number: 20230293514
    Abstract: Disclosed herein is an injectable depot formulation and use thereof for treating a mental disorder. The injectable depot formulation comprises cariprazine free base particles and a pharmaceutically acceptable carrier. The cariprazine free base particles have a median particle size by volume (Dv50) ranging from 0.5 ?m to 100 ?m.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 21, 2023
    Inventors: I-Hsiang LIU, Kuei-Hua CHANG, Hua-Jing JHAN, Tse-Hsien CHEN, Chia-Yu SU, Chi-Heng JIAN, Chun-Wei HSU
  • Patent number: 7968968
    Abstract: An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnect is connected to the other end of the metal bridge. In addition, resistivity of the pad metal layer is lower than that of the metal spiral.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: June 28, 2011
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Hsiung Wang, Chih-Ping Chao, Chia-Yu Su
  • Publication number: 20100265025
    Abstract: An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnect is connected to the other end of the metal bridge. In addition, resistivity of the pad metal layer is lower than that of the metal spiral.
    Type: Application
    Filed: May 28, 2010
    Publication date: October 21, 2010
    Inventors: Sung-Hsiung Wang, Chih-Ping Chao, Chia-Yu Su