Patents by Inventor Chia-Yu YEH

Chia-Yu YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088284
    Abstract: Disclosed is a semiconductor device and a method for fabricating such semiconductor device, specifically a High Electron Mobility Transistor (HEMT) with a back barrier layer for blocking electron leakage and improve threshold voltage. In one embodiment, a semiconductor device, includes: a Gallium Nitride (GaN) layer; a front barrier layer over the GaN layer; a source electrode, a drain electrode and a gate electrode formed over the front barrier layer; a 2-Dimensional Electron Gas (2-DEG) in the GaN layer at a first interface between the GaN layer and the front barrier layer; and a back barrier layer in the GaN layer, wherein the back barrier layer comprises Aluminum Nitride (AlN).
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Chia-Ling YEH, Pravanshu MOHANTA, Ching-Yu CHEN, Jiang-He XIE, Yu-Shine LIN
  • Publication number: 20240079229
    Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes: forming a transistor region in a substrate; forming a gate dielectric layer over the transistor region; forming a diffusion-blocking layer over the gate dielectric layer; forming a first portion of a work function layer over the diffusion-blocking layer; forming a second portion of the work function layer over the first portion of the work function layer; forming a plurality of barrier elements on or under a top surface of the second portion of the work function layer; and forming a gate electrode over the work function layer, wherein the plurality of barrier elements block oxygen from diffusing into the work function layer during the formation of the gate electrode.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Inventors: CHIA CHAN FAN, CHUNG-LIANG CHENG, CHIN-CHIA YEH, CHIEH CHIANG, CHENG YU PAI
  • Publication number: 20240065390
    Abstract: Bands for wearable devices include multiple band retainers used to maintain engagement between an assembly (e.g., a pair) of bands. Some band retainers may be permanently affixed with the band at a certain location of the band, while other band retainers can be removable. The removable band retainers can be moved to different locations of the band, thus allowing the band retainer to retain another band at different locations. As a result, the assembly of bands can be used with different users, and in particular, users with different wrist sizes. Moreover, using multiple band retainers can provide an engagement force between the bands to withstand higher-impact events, such as swimming and diving. Additionally, bands and band retainers may include one or more liquid-resistant and corrosion-resistant materials.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 29, 2024
    Inventors: Nicholas S. Brodine, Molly J. Anderson, Clement C. Tissandier, Osamu Yabe, Mengxi Zhao, Timothy S. Lui, Chia Tse Yeh, Kai-Yu Chung, Jen-Chun Hsu, Tatsuya Sano, Peng Li
  • Patent number: 11603846
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 14, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Chia-Ying Hsu, Chia-Yu Yeh, Chi-Chang Teng
  • Patent number: 11421692
    Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: August 23, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Chia-Ying Hsu, Chia-Yu Yeh, Chi-Chang Teng
  • Publication number: 20210025399
    Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Publication number: 20210025397
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Patent number: 7235618
    Abstract: Embodiments of the present invention include a polypropylene homopolymer synthesized from a metallocene catalyst system and methods of forming the homopolymer, the homopolymer having an aluminum and chlorine recoverables value of less than 25 ppm and a xylene solubles of less than 1 wt % relative to the total weight of the homopolymer. The resulting homopolymer has other desirable properties such as a heat deflection temperature at 0.45 MPa of from 90° C. to 110° C., and a MWD value of from 1.7 to 5.0. These properties make embodiments of the homopolymer desirable for films, and in particular for capacitor films.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: June 26, 2007
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Chon-Yie Lin, Bernard Louis Bossaert, Michael Chia-Chao Chen, Susan Chia-Yu Yeh
  • Publication number: 20040171782
    Abstract: Embodiments of the present invention include a polypropylene homopolymer synthesized from a metallocene catalyst system and methods of forming the homopolymer, the homopolymer having an aluminum and chlorine recoverables value of less than 25 ppm and a xylene solubles of less than 1 wt % relative to the total weight of the homopolymer. The resulting homopolymer has other desirable properties such as a heat deflection temperature at 0.45 MPa of from 90° C. to 110° C., and a MWD value of from 1.7 to 5.0. These properties make embodiments of the homopolymer desirable for films, and in particular for capacitor films.
    Type: Application
    Filed: July 8, 2003
    Publication date: September 2, 2004
    Inventors: Chon-Yie Lin, Bernard Louis Bossert, Chen Michael Chia-Chao, Susan Chia-Yu Yeh