Patents by Inventor Chia-Yun Hsu
Chia-Yun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978714Abstract: A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.Type: GrantFiled: December 19, 2022Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh
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Publication number: 20240099030Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.Type: ApplicationFiled: April 20, 2023Publication date: March 21, 2024Inventors: Kuan-Yu Huang, Sung-Hui Huang, Kuo-Chiang Ting, Chia-Hao Hsu, Hsien-Pin Hsu, Chih-Ta Shen, Shang-Yun Hou
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Patent number: 11931456Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: November 16, 2022Date of Patent: March 19, 2024Assignee: MegaPro Biomedical Co. Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11515220Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.Type: GrantFiled: December 4, 2019Date of Patent: November 29, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Yun Hsu, Ying-Chung Chen
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Patent number: 11482460Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.Type: GrantFiled: December 4, 2019Date of Patent: October 25, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Yun Hsu, Ying-Chung Chen
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Patent number: 11276720Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.Type: GrantFiled: October 31, 2019Date of Patent: March 15, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shih-Chieh Tang, Lu-Ming Lai, Chia Yun Hsu
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Publication number: 20210175135Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.Type: ApplicationFiled: December 4, 2019Publication date: June 10, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chia Yun HSU, Ying-Chung CHEN
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Publication number: 20210134857Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.Type: ApplicationFiled: October 31, 2019Publication date: May 6, 2021Inventors: Shih-Chieh TANG, Lu-Ming LAI, Chia Yun HSU
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Patent number: 10872915Abstract: An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1?H3.Type: GrantFiled: January 22, 2019Date of Patent: December 22, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Yun Hsu, Ying-Chung Chen
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Publication number: 20200235153Abstract: An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1?H3.Type: ApplicationFiled: January 22, 2019Publication date: July 23, 2020Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Yun HSU, Ying-Chung CHEN
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Patent number: 9911877Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.Type: GrantFiled: November 9, 2016Date of Patent: March 6, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Chia Yun Hsu, Tsung-Yu Lin
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Publication number: 20170207352Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.Type: ApplicationFiled: November 9, 2016Publication date: July 20, 2017Inventors: Hsin-Ying HO, Chia Yun HSU, Tsung-Yu LIN
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Patent number: 8710529Abstract: A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.Type: GrantFiled: July 3, 2012Date of Patent: April 29, 2014Assignee: Everlight Electronics Co., Ltd.Inventors: Ying-Zhong Chen, Chih-Hung Hsu, Chia-Yun Hsu
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Patent number: 8378368Abstract: A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions.Type: GrantFiled: May 3, 2010Date of Patent: February 19, 2013Assignee: Everlight Electronics Co., Ltd.Inventors: Chia-Yun Hsu, Chih-Hung Hsu
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Publication number: 20120267667Abstract: A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.Type: ApplicationFiled: July 3, 2012Publication date: October 25, 2012Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Ying-Zhong Chen, Chih-Hung Hsu, Chia-Yun Hsu
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Patent number: 8247830Abstract: A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.Type: GrantFiled: January 21, 2010Date of Patent: August 21, 2012Assignee: Everlight Electronics Co., Ltd.Inventors: Ying-Zhong Chen, Chih-Hung Hsu, Chia-Yun Hsu
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Patent number: 8240879Abstract: An illumination module includes a substrate and a plurality of LED devices. The substrate has a main plane, and the main plane includes a central region and a peripheral region. The LED devices are disposed on the main plane of the substrate in the central region and peripheral region. Each of the LED devices has a light-exiting direction, where the light-exiting direction of the LED device disposed in the central region is substantially perpendicular to the main plane, and the light-exiting direction of each of the LED devices in the peripheral region goes outwards with respect to the central region.Type: GrantFiled: November 24, 2009Date of Patent: August 14, 2012Assignee: Everlight Electronics Co., Ltd.Inventors: Chia-Yun Hsu, Ying-Jhong Chen
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Publication number: 20110079806Abstract: A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions.Type: ApplicationFiled: May 3, 2010Publication date: April 7, 2011Inventors: Chia-Yun Hsu, Chih-Hung Hsu
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Publication number: 20110080734Abstract: An optical pointing device includes a light source, a lens and a reflector. The light source is utilized to provide a light beam, and the lens is disposed on the light path of the light beam to focus the light beam. The reflector is disposed on the light path of the light beam between the light source and the lens for reflecting the light beam, so that the length of the optical pointing device can be reduced.Type: ApplicationFiled: December 10, 2009Publication date: April 7, 2011Inventor: Chia-Yun Hsu
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Publication number: 20100187562Abstract: A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.Type: ApplicationFiled: January 21, 2010Publication date: July 29, 2010Inventors: Ying-Zhong Chen, Chih-Hung Hsu, Chia-Yun Hsu