Patents by Inventor Chiah Chin LIM

Chiah Chin LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELATED STRUCTURE
    Publication number: 20220254696
    Abstract: A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.
    Type: Application
    Filed: January 13, 2022
    Publication date: August 11, 2022
    Applicant: Infineon Technologies AG
    Inventors: Angela KESSLER, Kok Yau CHUA, Josef HOEGLAUER, Chiah Chin LIM, Mei Qi TAY