Abstract: A method is provided that is implemented by a first NFC device configured in reader mode. The method includes evaluating an information about the coupling between the first NFC device and a second NFC device configured in card mode, as a function of the position of an antenna of the first NFC device with respect to an antenna of the second NFC device. The method further includes indicating the information by a user interface of the first device.

Abstract: The present disclosure generally relates to managing one or more displays. In particular, methods for moving an indicator between displays, moving an indicator based on body movement, and managing display operations are discussed herein.

Abstract: A hot box device and an operating method thereof are provided. The hot box device includes a first shell, a reformer, a burner, and a cathode inlet pipe. The first shell has a first cavity. The reformer is disposed in the first cavity. The burner is disposed in the reformer and has an opening. The cathode inlet pipe is disposed in the first cavity and extends through the first shell. The cathode inlet pipe is in fluid communication with the first cavity, and the opening of the burner is in fluid communication with the first cavity.

Abstract: The present invention is an indicator evaluation method of a cluster stability, which is executed by an indicator evaluation system of a cluster stability. The indicator evaluation system includes a processing device. The processing device uniformly down-samples a raw data to be clustered to generate sub-data. The processing device calculates similarities of the sub-data according to a statistical test, and keeps the sub-data with the similarities greater than a similarity threshold as sub-data to be analyzed. The processing device clusters the sub-data to be analyzed to generate sub-data cluster results. The processing device organizes cluster label models of the sub-data cluster results, and generates organized sub-data cluster results according to organized cluster label models. The processing device further calculates a cluster stability indicator according to the organized sub-data cluster results.

Abstract: The present disclosure generally relates to embodiments for a live communication interface for managing captions.

Abstract: An electrolyzer includes a casing and an electrolytic device. The casing includes two side plates. The electrolytic device is disposed between the two side plates, and the electrolytic device includes a plurality of porous layers, a plurality of current collector plates, a plurality of membranes and a plurality of heating units. The current collector plates are arranged in an alternating manner with the porous layers. The membranes are disposed corresponding to the porous layers. The heating units are respectively disposed on at least some of the current collector plates.

Abstract: The present disclosure generally relates to managing one or more displays. In particular, methods for moving an indicator between displays, moving an indicator based on body movement, and managing display operations are discussed herein.

Abstract: A hot box device and an operating method thereof are provided. The hot box device includes a first shell, a reformer, a burner, and a cathode inlet pipe. The first shell has a first cavity. The reformer is disposed in the first cavity. The burner is disposed in the reformer and has an opening. The cathode inlet pipe is disposed in the first cavity and extends through the first shell. The cathode inlet pipe is in fluid communication with the first cavity, and the opening of the burner is in fluid communication with the first cavity.

Abstract: A connecting assembly is applied to connect a first housing and a second housing. The connecting assembly includes a general connecting member, a connecting base, and a clamping member. The general connecting member connects to the first housing. The general connecting member includes an accommodating portion and at least one opening. The accommodating portion is located inside the general connecting member. The opening is disposed on a side wall of the general connecting member and communicates with the accommodating portion. The connecting base is disposed on the second housing. The connecting base includes a main body disposed in the accommodating portion. The clamping member includes a flat portion and at least one clamping portion. The clamping portion extends from one end of the flat portion toward the connecting base, and the clamping portion passes through the opening and presses against the main body of the connecting base.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.

Abstract: A connecting assembly is applied to connect a first housing and a second housing. The connecting assembly includes a general connecting member, a connecting base, and a clamping member. The general connecting member connects to the first housing. The general connecting member includes an accommodating portion and at least one opening. The accommodating portion is located inside the general connecting member. The opening is disposed on a side wall of the general connecting member and communicates with the accommodating portion. The connecting base is disposed on the second housing. The connecting base includes a main body disposed in the accommodating portion. The clamping member includes a flat portion and at least one clamping portion. The clamping portion extends from one end of the flat portion toward the connecting base, and the clamping portion passes through the opening and presses against the main body of the connecting base.

Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.

Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.

Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.

Abstract: A method is provided that is implemented by a first NFC device configured in reader mode. The method includes evaluating an information about the coupling between the first NFC device and a second NFC device configured in card mode, as a function of the position of an antenna of the first NFC device with respect to an antenna of the second NFC device. The method further includes indicating the information by a user interface of the first device.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.

Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.

Abstract: The present disclosure generally relates to enlarging user interface elements. An example method includes displaying a first version of first content; while displaying the first version of first content, displaying a focus indicator at a first location that does not correspond to the first version of first content; receiving first input; in response to receiving the first input, moving the focus indicator to a second location; in accordance with the second location corresponding to the first version and a set of second version display criteria being met, concurrently displaying at least a portion of the first version of first content and a second version of first content, wherein the second version differs from the first version in a visual characteristic other than size; and in accordance with the second location not corresponding to the first version of first content, forgoing display of the second version of first content.

Abstract: A method, a system, and a computer-readable medium for planning a path are provided. The method comprises the following steps. A plurality of pictures with geographic information are received from a cloud server. A selection signal selecting at least two of the pictures is received and the geographic information of the selected pictures is obtained. The path is planned according to the geographic information and then displayed on a map.

Abstract: A method for forming a through wafer via hole in a semiconductor device, wherein the semiconductor device comprises a wafer having a SiC substrate with a front side and a backside, a GaN-based layer formed on the front side of the SiC substrate, and a mask structure formed on the backside of the SiC substrate defining an etching area. The etching area is first descummed A through substrate via hole is formed by etching the etching area through the SiC substrate. The mask structure is removed and the inner surface of the through substrate via hole is cleaned. The inner surface of the through substrate via hole is then descummed A through wafer via hole is formed by etching through the GaN layer in the through substrate via hole. And lastly the inner surface of the through wafer via hole is cleaned.