Patents by Inventor Chia-Ho Liu

Chia-Ho Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming spacers of different sizes
    Patent number: 7674718
    Abstract: A method for forming spacers of different sizes includes the following steps. First a substrate is provided, which has a first element, a second element, a first material layer and a second material layer thereon. A first dry etching is performed to remove part of the second material layer to form a first spacer by the first element and to form a second side wall by the second element, so that the first material layer between the first spacer and the second side wall is exposed to become a damaged first material layer. A trimming procedure is performed to trim the damaged first material layer. A mask is used to cover the first element, the first spacer and part of the first material layer then a wet etching is performed to remove the second side wall.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: March 9, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Chia-Ho Liu, Chieh-Yu Tsai, Wei-Chen Lin, Chia-Ying Lin
  • METHOD FOR FORMING SPACERS OF DIFFERENT SIZES
    Publication number: 20090197417
    Abstract: A method for forming spacers of different sizes includes the following steps. First a substrate is provided, which has a first element, a second element, a first material layer and a second material layer thereon. A first dry etching is performed to remove part of the second material layer to form a first spacer by the first element and to form a second side wall by the second element, so that the first material layer between the first spacer and the second side wall is exposed to become a damaged first material layer. A trimming procedure is performed to trim the damaged first material layer. A mask is used to cover the first element, the first spacer and part of the first material layer then a wet etching is performed to remove the second side wall.
    Type: Application
    Filed: February 4, 2008
    Publication date: August 6, 2009
    Inventors: Chia-Ho Liu, Chieh-Yu Tsai, Wei-Chen Lin, Chia-Ying Lin