Abstract: A method of applying heat shield material to form a heat shield layer on a crown surface of a piston of an engine is provided. The method includes the steps of disposing a dispenser that linearly discharges the heat shield material toward the crown surface, and moving an applied position of the heat shield material with respect to the crown surface in a circumferential direction of the crown surface, while discharging the heat shield material from the dispenser toward the crown surface.

Abstract: A method of applying to a crown surface of a piston, a heat shield material for forming a heat shield layer, is provided. The method includes masking the piston with a masking member, the masking member including a first part that covers at least part of a side surface of the piston with a first clearance between the side surface and the first part, and a second part that covers an outer circumferential part of the crown surface with a second clearance between the outer circumferential part and the second part, and applying the heat shield material, while the piston is masked.

Abstract: A method of applying heat shield material to form a heat shield layer on a crown surface of a piston of an engine is provided. The method includes the steps of disposing a dispenser that linearly discharges the heat shield material toward the crown surface, and moving an applied position of the heat shield material with respect to the crown surface in a circumferential direction of the crown surface, while discharging the heat shield material from the dispenser toward the crown surface.

Abstract: A thermoplastic resin molding according to the present invention contains carbon fibers. An amount of the carbon fibers falls within a range from 0.4 mass % to 10 mass %. An average length of the carbon fibers falls within a range from 0.5 mm to 15 mm. The thermoplastic resin is polypropylene. The polypropylene includes polypropylene containing at least one of a carboxyl group, a carbonyl group, or a hydroxyl group. Surfaces of the carbon fibers contain at least one of a carboxyl group, a carbonyl group, a hydroxyl group, or a Cl group.

Abstract: A thermoplastic resin molding according to the present invention contains carbon fibers. An amount of the carbon fibers falls within a range from 0.4 mass % to 10 mass %. An average length of the carbon fibers falls within a range from 0.5 mm to 15 mm. The thermoplastic resin is polypropylene. The polypropylene includes polypropylene containing at least one of a carboxyl group, a carbonyl group, or a hydroxyl group. Surfaces of the carbon fibers contain at least one of a carboxyl group, a carbonyl group, a hydroxyl group, or a Cl group.

Abstract: A polypropylene-based resin composition suitable for molding of especially an automobile bumper having good formability, high rigidity, excellent appearance, and high surface impact strength is provided. This composition includes: 30-62 wt. % of a propylene copolymer having an MFR of 40-70 g/10 min.; 5-20 wt. % of a propylene-based block copolymer including a crystalline polypropylene part having a high MFR and a specific ethylene-propylene copolymer part and having an MFR of 100-130 g/10 min; 10-20 wt. % of two types of ethylene-?-olefin copolymer elastomers each having a specific MFR and a specific density; and 23-30 wt. % of talc having a specific particle size.

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.

Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).

Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.

Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, 1

Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.

Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.

Abstract: This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.