Patents by Inventor Chiaki Hatsuta

Chiaki Hatsuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145356
    Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
    Type: Application
    Filed: September 1, 2022
    Publication date: May 2, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masahiro NAGATA, Kazuhiro SHINOZAKI, Masahiro YAMADA, Daisuke OKUYAMA, Chiaki HATSUTA, Kentarou SEKI, Hideto MATSUI, Kazunori OOUCHI
  • Publication number: 20240051267
    Abstract: Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (?m) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R?0.056X+2.0, where X=thickness (?m) of aluminum alloy foil.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 15, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Atsuko TAKAHAGI, Tatsuro ISHITOBI, Chiaki HATSUTA, Makoto KOMUKAI, Mayo SUGANO
  • Publication number: 20240030114
    Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masahiro NAGATA, Kazuhiro SHINOZAKI, Masahiro YAMADA, Daisuke OKUYAMA, Chiaki HATSUTA, Kentarou SEKI, Hideto MATSUI, Kazunori OOUCHI
  • Patent number: 11820104
    Abstract: Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (?m) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R?0.056X+2.0, where X=thickness (?m) of aluminum alloy foil.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: November 21, 2023
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Atsuko Takahagi, Tatsuro Ishitobi, Chiaki Hatsuta, Makoto Komukai, Mayo Sugano
  • Patent number: 11732361
    Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: August 22, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki Oka, Chikao Ikenaga, Sachiyo Matsuura, Shogo Endo, Chiaki Hatsuta, Asako Narita
  • Patent number: 11733607
    Abstract: A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: August 22, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura
  • Publication number: 20230253708
    Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.
    Type: Application
    Filed: April 9, 2021
    Publication date: August 10, 2023
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Seiji TAKE, Shuji KAWAGUCHI, Chiaki HATSUTA
  • Patent number: 11667983
    Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: June 6, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki Oka, Chikao Ikenaga, Sachiyo Matsuura, Shogo Endo, Chiaki Hatsuta, Asako Narita
  • Publication number: 20230062683
    Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.
    Type: Application
    Filed: April 28, 2021
    Publication date: March 2, 2023
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Seiji TAKE, Shuji KAWAGUCHI, Chiaki HATSUTA
  • Publication number: 20220140426
    Abstract: Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (?m) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R?0.056X+2.0, where X=thickness (?m) of aluminum alloy foil.
    Type: Application
    Filed: January 11, 2022
    Publication date: May 5, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Atsuko Takahagi, Tatsuro Ishitobi, Chiaki Hatsuta, Makoto Komukai, Mayo Sugano
  • Publication number: 20220121115
    Abstract: The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.
    Type: Application
    Filed: December 29, 2021
    Publication date: April 21, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki OKA, Sachiyo MATSUURA, Chiaki HATSUTA, Chikao IKENAGA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Patent number: 11258123
    Abstract: Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (rpm) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R?0.056X+2.0, where X=thickness (rpm) of aluminum alloy foil.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: February 22, 2022
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Atsuko Takahagi, Tatsuro Ishitobi, Chiaki Hatsuta, Makoto Komukai, Mayo Sugano
  • Patent number: 11237481
    Abstract: The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.
    Type: Grant
    Filed: September 21, 2019
    Date of Patent: February 1, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki Oka, Sachiyo Matsuura, Chiaki Hatsuta, Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa
  • Patent number: 11118258
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
  • Publication number: 20210214843
    Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.
    Type: Application
    Filed: December 15, 2020
    Publication date: July 15, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yasuko SONE, Hiroshi KAWASAKI, Yoshinori HIROBE, Katsunari OBATA, Asako NARITA, Hitoshi ISHIRO, Chiaki HATSUTA
  • Publication number: 20210157232
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Chiaki HATSUTA, Hiroki OKA, Sachiyo MATSUURA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Publication number: 20210108312
    Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki OKA, Chikao IKENAGA, Sachiyo MATSUURA, Shogo ENDO, Chiaki HATSUTA, Asako NARITA
  • Publication number: 20210102268
    Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.
    Type: Application
    Filed: July 28, 2020
    Publication date: April 8, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki OKA, Chikao IKENAGA, Sachiyo MATSUURA, Shogo ENDO, Chiaki HATSUTA, Asako NARITA
  • Patent number: 10895008
    Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 19, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yasuko Sone, Hiroshi Kawasaki, Yoshinori Hirobe, Katsunari Obata, Asako Narita, Hitoshi Ishiro, Chiaki Hatsuta
  • Publication number: 20200259090
    Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.
    Type: Application
    Filed: March 30, 2018
    Publication date: August 13, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yasuko SONE, Hiroshi KAWASAKI, Yoshinori HIROBE, Katsunari OBATA, Asako NARITA, Hitoshi ISHIRO, Chiaki HATSUTA