Patents by Inventor Chiaki Higuchi

Chiaki Higuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6544654
    Abstract: A thick-film resistor contains RuO2 and an SiO2—B2O3—K2O glass having a composition of 60 wt %≦SiO2≦85 wt %, 15 wt %≦B2O3≦40 wt %, 0.1 wt %≦K2O≦10 wt %, and impurity ≦3 wt %. A ceramic circuit board includes a thick-film resistor printed on it, the thick-film resistor containing RuO2 and an SiO2—B2O3—K2O glass having the above composition.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: April 8, 2003
    Assignee: Sumitomo Metal (SMI) Electronics Devices, Inc.
    Inventors: Masashi Fukaya, Koji Shibata, Chiaki Higuchi, Yoshinobu Watanabe
  • Patent number: 6123874
    Abstract: A thick-film resistor paste consists of a first glass powder, a second glass powder, a conductive material powder, and an organic vehicle. A quantity of the first glass powder mixed is larger than a quantity of the second glass powder mixed. The first glass powder contains, in total, 95 percentage by weight or above of CaO of 20 to 26 percentage by weight, SiO.sub.2 of 37 to 59 percentage by weight, Al.sub.2 O.sub.3 of 5 to 13 percentage by weight and B.sub.2 O.sub.3 of 8 to 28 percentage by weight. The second glass powder contains, in total, 85 percentage by weight or above of SiO.sub.2 of 53 to 72 percentage by weight, B.sub.2 O.sub.3 of 20 to 30 percentage by weight and Na.sub.2 O of 1 to 7 percentage by weight. The thermal expansion coefficient of the first glass powder is larger by 0.5.times.10.sup.-6 /deg or above than the thermal expansion coefficient of the second glass powder.
    Type: Grant
    Filed: February 3, 1998
    Date of Patent: September 26, 2000
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Masashi Fukaya, Tomoko Matsuo, Yoshinobu Watanabe, Chiaki Higuchi