Abstract: A booklet includes a sheet-like first substrate, and a sheet-like second substrate that is attached to the first substrate. The first substrate includes a light-transmitting region, and an optical functional unit is provided to the light-transmitting region. A latent image is provided to a surface of the second substrate that is opposite to the first substrate at a position corresponding to the optical functional unit. The latent image manifests when the optical functional unit operates by overlapping the first substrate with the second substrate.

Abstract: A booklet includes a sheet-like first substrate, and a sheet-like second substrate that is attached to the first substrate. The first substrate includes a light-transmitting region, and an optical functional unit is provided to the light-transmitting region. A latent image is provided to a surface of the second substrate that is opposite to the first substrate at a position corresponding to the optical functional unit. The latent image manifests when the optical functional unit operates by overlapping the first substrate with the second substrate.

Abstract: Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.

Abstract: Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.