Abstract: A semiconductor device (1) detecting damage to the peripheral part of a chip which could potentially grow into a defect includes: a wire (3) formed along the outer periphery of a semiconductor chip (2d) to detect damage; a detection circuit (4) provided in the semiconductor chip (2) to supply a detection signal to the wire (3) to detect a break in the wire (3); an output terminal (5) for outputting the detection signal having passed through the wire (3); an internal circuit (6) provided in the semiconductor chip (2); an output switching circuit (7) selecting either an output signal of the internal circuit (6) or the detection signal having passed the wire (3) for output to the output terminal (5); a heating element (15a) heating the peripheral part of the chip; a power supply circuit (16) supplying power to the heating element; and a temperature detection/control circuit (17) controlling the heating by the heating element.

Abstract: An automated light control system for controlling light emission from the backlight of the liquid crystal display in such a manner that the power consumption can be reduced, taking the information on the brightness in the peripheral region and the information on the distance into total consideration, is provided. The automated light control system is characterized in that a brightness information detecting means for detecting the brightness in the periphery and outputting information on the brightness for indicating the brightness and a distance information detecting means for outputting information on the distance for indicating the distance between the liquid crystal display and the user are provided, and the amount of light emitted by the light illumination means (backlight) is controlled on the basis of both the above described information on the brightness and the above described information on the distance.

Abstract: A semiconductor device (1) detecting damage to the peripheral part of a chip which could potentially grow into a defect includes: a wire (3) formed along the outer periphery of a semiconductor chip (2d) to detect damage; a detection circuit (4) provided in the semiconductor chip (2) to supply a detection signal to the wire (3) to detect a break in the wire (3); an output terminal (5) for outputting the detection signal having passed through the wire (3); an internal circuit (6) provided in the semiconductor chip (2); an output switching circuit (7) selecting either an output signal of the internal circuit (6) or the detection signal having passed the wire (3) for output to the output terminal (5); a heating element (15a) heating the peripheral part of the chip; a power supply circuit (16) supplying power to the heating element; and a temperature detection/control circuit (17) controlling the heating by the heating element.