Abstract: An imaging apparatus includes a first reflection optical system and a second reflection optical system having mutually different optical axes, each of the first and second reflection optical systems includes a plurality of reflecting surfaces, a first imaging portion configured to receive an imaging light reflected by the first reflection optical system, a second imaging portion configured to receive an imaging light reflected by the second reflection optical system, a first member, a second member, and a frame. A part of the plurality of reflecting surfaces of the first reflection optical system are reflecting surfaces provided on the frame. Among the plurality of reflecting surfaces of the first reflection optical system, a final-stage reflecting surface configured to reflect the imaging light toward the first imaging portion is a first reflecting surface formed on a surface of the first member.

Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

Abstract: A dry toner composition comprising (A) a binder resin, (B) a colorant and (C) charge control agents comprising a special metal complex of oxycarboxylic acid (C-1) and a special metal complex of azo compound (C-2) can provide high quality images without causing toner flying even after printed for a long period of time, and thus is useful for providing a dry developer and a process for forming images using said dry developer.