Patents by Inventor Chiaki OZAKI

Chiaki OZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device and semiconductor device
    Patent number: 11101404
    Abstract: A method for manufacturing a semiconductor device includes: preparing a wafer including sapphire, the wafer having an upper surface that includes a first region and a second region, the second region surrounding the first region and located at a position at least 2 ?m higher or lower than the first region; and forming a semiconductor layer at the upper surface, the semiconductor layer including at least one layer that comprises AlzGa1?zN (0.03?z?0.15).
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: August 24, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Yoshinori Miyamoto, Tokutaro Okabe, Yuya Kagoshima, Keisuke Higashitani, Chiaki Ozaki
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    Publication number: 20190296190
    Abstract: A method for manufacturing a semiconductor device includes: preparing a wafer including sapphire, the wafer having an upper surface that includes a first region and a second region, the second region surrounding the first region and located at a position at least 2 ?m higher or lower than the first region; and forming a semiconductor layer at the upper surface, the semiconductor layer including at least one layer that comprises AlzGa1-zN (0.03?z?0.15).
    Type: Application
    Filed: March 14, 2019
    Publication date: September 26, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Yoshinori MIYAMOTO, Tokutaro OKABE, Yuya KAGOSHIMA, Keisuke HIGASHITANI, Chiaki OZAKI