Abstract: A method of forming a partially etched nitride-based compound semiconductor crystal layer includes the following steps. A non-crystal layer of a nitride-based compound semiconductor is formed. At least a part of the non-crystal layer is then etched to form a partially etched non-crystal layer before the partially etched non-crystal layer is crystallized to form a partially etched nitride-based compound semiconductor crystal layer.

Abstract: The present invention provides a semiconductor laser excellent in the current injection efficiency. In an inner stripe type semiconductor laser according to the present invention, a p type cladding layer 309 has a superlattice structure composed of GaN layers and Al0.1Ga0.9N layers, which are alternately layered on each other. The p type cladding layer 309 has a portion of high dislocation density and a portion of low dislocation density. That is, the dislocation density is relatively low in a region directly above an opening of the current-confining region 308, whereas the dislocation density is relatively high in a region directly above a current-confining region 308.

Abstract: A semiconductor laser, which emits a laser beam from an edge surface of an active layer (5), is provided with a protective film (20), arranged on the edge surface from which the laser beam is emitted, and formed of a single-layer or a multilayer dielectric film. Hydrogen concentration distribution in the protective film (20) is approximately flat. The active layer (5) is formed of a group-III nitride semiconductor including Ga as a constituent element. The protective film (20) is formed of at least a first protective film (21) that is in direct contact with an edge surface of the active layer (5), and a second protective film (22) that is in contact with the first protective film (21). A ratio of hydrogen concentration of the first protective film (21) with respect to hydrogen concentration of the second protective film (22) is not less than 0.5 and not more than 2.

Abstract: The present invention provides a semiconductor laser excellent in the current injection efficiency. In an inner stripe type semiconductor laser according to the present invention, a p type cladding layer 309 has a superlattice structure composed of GaN layers and Al0.1Ga0.9N layers, which are alternately layered on each other. The p type cladding layer 309 has a portion of high dislocation density and a portion of low dislocation density. That is, the dislocation density is relatively low in a region directly above an opening of the current-confining region 308, whereas the dislocation density is relatively high in a region directly above a current-confining region 308.

Abstract: Damages in the semiconductor layers at the chip separating surfaces are suppressed in a semiconductor laser employing a GaN-based semiconductor substrate made of GaN and AlGaN. Laminated layers including a n-type clad layer (502) made of AlGaN and a multi-quantum well (MQW) layer (504) serving to be an active layer is formed on an independent GaN substrate (501). The side surfaces of the laminated layers along the direction of the resonator are inclined in such a direction that the resonator width is decreased from the independent GaN substrate (501) to the laminated layers.

Abstract: Polycrystalline AlN 3 is deposited on the surface of an SiO2 film (2) by a sputtering method, and a mask is formed. An Si-doped n-GaN layer 5 is then formed over the mask thus formed. Subsequently, an n-type cladding layer (6), which is formed from Si-doped n-type Al0.1Ga0.9N (silicon concentration 4×1017 cm?3, thickness 1.2 ?m), an n-type light-trapping layer (7), which is formed from Si-doped n-type GaN, a multiple quantum well layer (8), which is formed from an In0.2Ga0.8N well layer and an Si-doped In0.05Ga0.95N barrier layer, a cap layer (9), which is formed from Mg-doped p-type Al0.2Ga0.8N, a p-type light-trapping layer (10), which is formed from Mg-doped p-type GaN, a p-type cladding layer (11), which is formed from Mg-doped p-type Al0.1Ga0.9N, and a p-type contact layer (12), which is formed from Mg-doped p-type GaN, are grown in sequence to form an LD layer structure.

Abstract: A method of forming a partially etched nitride-based compound semiconductor crystal layer includes the following steps. A non-crystal layer of a nitride-based compound semiconductor is formed. At least a part of the non-crystal layer is then etched to form a partially etched non-crystal layer before the partially etched non-crystal layer is crystallized to form a partially etched nitride-based compound semiconductor crystal layer.

Abstract: A method of forming a partially etched nitride-based compound semiconductor crystal layer includes the following steps. A non-crystal layer of a nitride-based compound semiconductor is formed. At least a part of the non-crystal layer is then etched to form a partially etched non-crystal layer before the partially etched non-crystal layer is crystallized to form a partially etched nitride-based compound semiconductor crystal layer.

Abstract: A method of forming a partially etched nitride-based compound semiconductor crystal layer includes the following steps. A non-crystal layer of a nitride-based compound semiconductor is formed. At least a part of the non-crystal layer is then etched to form a partially etched non-crystal layer before the partially etched non-crystal layer is crystallized to form a partially etched nitride-based compound semiconductor crystal layer.

Abstract: A MOVPE method is provided that makes it possible to grow a high-quality nitride crystal of a group III element. The method comprises the steps (a) to (d). In the step (a), an organometallic compound in a gas phase is supplied to a reaction chamber as a group III component material by a carrier gas. In the step (b), a nitrogen compound in a gas phase is supplied to the chamber as a group V component material by the carrier gas. In the step (c), a hydrocarbon in a gas phase is supplied to the chamber by the carrier gas. In the step (d), the organometallic compound and the nitrogen compound are reacted with each other in a atmosphere containing the hydrocarbon in the chamber to grow a nitride crystal of a group III element on a crystalline substrate. As the hydrocarbon, any hydrocarbon containing at least one carbon-to-carbon (i.e., C—C) bond in its molecule (i.e., alkanes) may be used. Preferably, any hydrocarbon containing at least one double or triple carbon-to-carbon bond (i.e.

Abstract: A process for producing a semiconductor light-emitting device, which comprises forming, on a substrate by crystal growth, a gallium nitride type compound semiconductor layer having a crystal face (0,0,0,1) which can be utilized as the end surface of an optical waveguide or as a cavity mirror surface.

Abstract: In a method of manufacturing a semiconductor device which includes a quartz substrate having a z-cut plane of (0001) plane on a surface, a GaN film is first deposited on the surface. Finally, the quartz substrate is removed from the GaN film. The removed GaN film is used as a real substrate for forming GaN based compound semiconductor layers thereon.

Abstract: A magnesium-doped semiconductor layer expressed by general formula Al.sub.x Ga.sub.1-x N (where 0.ltoreq.x.ltoreq.1) is formed on a substrate. Thereafter, on the semiconductor layer, a plurality of semiconductor layers (including an activation layer) expressed by general formula In.sub.x Al.sub.y Ga.sub.1-x-y N (where 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1) are formed. The crystalline characteristics of semiconductor layers including a light emitting layer of a gallium nitride semiconductor light emitting device having a magnesium-doped gallium nitride semiconductor layer are good. Thus, in the case that the light emitting device is a laser device, it can be expected that the oscillating threshold value of the laser device becomes low. In the case that the light emitting device is a light emitting diode, it can be expected that the light emitting efficiency of the light emitting diode becomes high.