Patents by Inventor Chiaki Shigematsu

Chiaki Shigematsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10850431
    Abstract: A conveyance device includes a plurality of holding mechanisms and one or more pressing mechanisms, the holding mechanisms each include a holder that holds a molding material and a holder movement mechanism that moves the holder, and the pressing mechanisms each include a pusher that comes into contact with and pushes the molding material and a pusher movement mechanism that moves the pusher.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: December 1, 2020
    Assignees: SHIBAURA MACHINE CO., LTD., TEIJIN LIMITED
    Inventors: Kazuhito Sato, Chiaki Shigematsu, Hodaka Yokomizo, Tetsuya Yoneda, Akihiko Obata
  • Patent number: 10843387
    Abstract: To provide a method of manufacturing a press molding by molding a molding material comprising reinforced fibers and a thermoplastic resin by a cold press method. The method of manufacturing a press molding comprising reinforced fibers and a thermoplastic resin, includes the steps of: holding the molding material heated at a temperature not lower than the softening temperature with a plurality of grippers installed on a carrier; carrying the molding material between the upper mold and the lower mold of a mold for molding; pushing the molding material with pushers to preform it at a predetermined preforming rate; and press molding the preformed molding by closing the upper mold and the lower mold and applying pressure.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: November 24, 2020
    Assignees: TEIJIN LIMITED, SHIBAURA MACHINE CO., LTD.
    Inventors: Hodaka Yokomizo, Tetsuya Yoneda, Akihiko Obata, Kazuhito Sato, Chiaki Shigematsu
  • Publication number: 20180361632
    Abstract: To provide a method of manufacturing a press molding by molding a molding material comprising reinforced fibers and a thermoplastic resin by a cold press method. The method of manufacturing a press molding comprising reinforced fibers and a thermoplastic resin, includes the steps of: holding the molding material heated at a temperature not lower than the softening temperature with a plurality of grippers installed on a carrier; carrying the molding material between the upper mold and the lower mold of a mold for molding; pushing the molding material with pushers to preform it at a predetermined preforming rate; and press molding the preformed molding by closing the upper mold and the lower mold and applying pressure.
    Type: Application
    Filed: December 16, 2016
    Publication date: December 20, 2018
    Applicants: TEIJIN LIMITED, TOSHIBA MACHINE CO., LTD.
    Inventors: Hodaka YOKOMIZO, Tetsuya YONEDA, Akihiko OBATA, Kazuhito SATO, Chiaki SHIGEMATSU
  • Publication number: 20180169901
    Abstract: A conveyance device includes a plurality of holding mechanisms and one or more pressing mechanisms, the holding mechanisms each include a holder that holds a molding material and a holder movement mechanism that moves the holder, and the pressing mechanisms each include a pusher that comes into contact with and pushes the molding material and a pusher movement mechanism that moves the pusher.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 21, 2018
    Applicants: Toshiba Kikai Kabushiki Kaisha, Teijin Limited
    Inventors: Kazuhito Sato, Chiaki Shigematsu, Hodaka Yokomizo, Tetsuya Yoneda, Akihiko Obata
  • Patent number: 5301862
    Abstract: A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.
    Type: Grant
    Filed: October 5, 1992
    Date of Patent: April 12, 1994
    Assignee: Fuji Seiki Machine Works, Ltd.
    Inventors: Chiaki Shigematsu, Naokatsu Kojima