Patents by Inventor Chian-Her Ueng

Chian-Her Ueng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packages having electromagnetic interference shielding and related methods
    Patent number: 9070793
    Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 30, 2015
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng, Yu-Hsiang Sun
  • SEMICONDUCTOR DEVICE PACKAGES HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND RELATED METHODS
    Publication number: 20120025356
    Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant. and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments. with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.
    Type: Application
    Filed: May 24, 2011
    Publication date: February 2, 2012
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng, Yu-Hsiang Sun