Patents by Inventor Chian-Kun Chan

Chian-Kun Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9741600
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: August 22, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chang Hsieh, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Chen, Hsu-Shui Liu, Kai Lo, Wei-ting Hsiao, Yung-Kai Lin
  • Publication number: 20160284584
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Application
    Filed: June 7, 2016
    Publication date: September 29, 2016
    Inventors: Hsieh Chih-Chang, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Cheng-Jen, Hsu-Shui Liu, Lo Kai, Wei-ting Hsiao, Yung-Kai Lin
  • Patent number: 9425077
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chang Hsieh, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao
  • Publication number: 20140273505
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Application
    Filed: April 9, 2013
    Publication date: September 18, 2014
    Inventors: Chih-Chang HSIEH, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao