Abstract: The present invention relates to a flexible ceramic substrate, which is a flexible substrate made of ceramic powder compound. The substrate includes a copper foil substrate having a thickness within a given range to form circuit board wiring through etching. The metal substrate has a surface on which a ceramic compound layer that is formed of a ceramic powder and a gum-like material of a predetermined weight ratio. The gum-like material fills in and wraps crystal gaps of the ceramic powder compound to bond the ceramic powder together to form a flexible ceramic compound layer of a predetermined thickness. The ceramic powder is bonded to the metal substrate to support heat-generating components and conduct and dissipate heat emitting from the heat-generating components.

Abstract: A composition with heat dissipation performance of ceramics includes ceramic particles that take a weight percentage of substantially 25%-90% of the composition, have a particle size substantially between 10-50 ?m, and thermal conductivity ??25 W/m·K, the ceramic particles being subjected to surface activation treatment; and metal particles that take a weight percentage of substantially 75%-10% of the composition and have thermal conductivity ??50 W/m·K. The ceramic particles and the metal particles are subjected to heating under a non-oxidizing environment to a temperature greater than the melting point of the metal but below the melting point of the ceramic particles, so that the metal is molten to form a metal melt that surrounds and bonds the ceramic particles, and then pouring and casting are performed in a non-oxidizing environment. As such, the metal that possesses excellent thermal conduction capability is also imposed with excellent thermal radiation capability of the ceramics.

Abstract: A composite for coating and sputtering a heat-dissipating film, wherein composite contains silicon carbide, resin, and dilute solvent which are mixed and blended to be capable of being coated, sputtered, and cured into a heat-dissipating film of a specific thickness. As such, the heat-dissipating performance could be conveniently enhanced. here is no need to rely on heat-sinking fins of large surface area. The production cost is reduced, recycling is easier, and the highly contaminating anodizing treatment could be avoided, while the robustness against erosion and harsh weather is still maintained.

Abstract: The invention provides a composite for coating and sputtering a heat-dissipating film. The composite contains silicon carbide of 25˜30 wt. % (weight percentage), teflon-based resin of 9-11 wt. %, and diluted ketones/alcohols-group material of 60˜65 wt. %. These components are mixed and blended to be capable of being coated, sputtered, and cured into a heat-dissipating film of a specific thickness. As such, the heat-dissipating performance could be conveniently enhanced. There is no need to rely on heat-sinking fins of large surface area. The production cost is reduced, recycling is easier, and the highly contaminating anodizing treatment could be avoided, while the robustness against erosion and harsh weather is still maintained.