Patents by Inventor CHIANG KAIPENG

CHIANG KAIPENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
    Publication number: 20130093069
    Abstract: The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
    Type: Application
    Filed: October 14, 2011
    Publication date: April 18, 2013
    Applicant: CYNTEC CO., LTD.
    Inventors: BAU-RU LU, JENG-JEN LI, CHIANG KAIPENG