Patents by Inventor Chiang-Lin Yen

Chiang-Lin Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BALL PAD DESIGN FOR SEMICONDUCTOR PACKAGES
    Publication number: 20220246508
    Abstract: A semiconductor structure includes a semiconductor die having an active surface, a passivation layer covering the active surface of the semiconductor die, and a post-passivation interconnect (PPI) layer disposed over the passivation layer. The PPI layer includes a ball pad having a first diameter. A polymer layer covers a perimeter of the ball pad. An under-bump-metallurgy (UBM) layer is disposed on the ball pad. The UBM layer has a second diameter that is greater than the first diameter of the ball pad. A solder ball is mounted on the UBM layer.
    Type: Application
    Filed: December 9, 2021
    Publication date: August 4, 2022
    Applicant: MEDIATEK INC.
    Inventors: Chiang-Lin Yen, Che-Hung Kuo