Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a photonic integrated circuit chip and an electronic integrated circuit chip are disposed on opposite sides of an interposer respectively, and the photonic integrated circuit chip and the electronic integrated circuit chip can accomplish signal connection with each other via a plurality of conductive vias in the interposer directly, thereby reducing the power consumption and transmission delay of the signals transmitted between the circuits.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of photonic integrated circuit chips and an auxiliary electronic element are separately configured on a package module to shorten the transmission distance of the optical signal. Therefore, the signal transmission rate of a circuit structure can be increased, thereby improving the overall operating performance of the electronic package.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: An electronic package is provided and includes: a thermally conductive chip; a circuit structure having a circuit layer; and an electronic component disposed between the circuit structure and the thermally conductive chip and electrically connected to the circuit layer, so as to dissipate the heat generated during the operation of the electronic component via the thermally conductive chip. A method of manufacturing the electronic package is further provided.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a heat sink with an opening is disposed on an electronic component of a carrier structure, a heat dissipation material is formed in the opening, and a heat dissipation lid is disposed on the opening to cover the heat dissipation material, such that the problem of insufficient heat dissipation due to the loss of the heat dissipation material can be prevented from occurring to the electronic component.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a full-panel wafer is provided and includes a plurality of electronic bodies arranged in an array at intervals, a plurality of trenches are formed across the electronic bodies along a first direction on the full-panel wafer, so that the trenches on a single electronic body are arranged parallel to each other at interval and along a second direction perpendicular to the first direction. Then, in a singulation process, any trench can be selected for cutting to obtain a plurality of electronic elements of a required size. Finally, each of the electronic elements is disposed on a packaging region of a carrier structure, so that each of the electronic elements is electrically connected to at least a portion of electrical contact pads in the packaging region.

Abstract: An electronic package and the manufacturing method thereof are provided, in which a photonic element and an electronic element are embedded in an encapsulation layer, and the photonic element has an external contact area exposed from the encapsulation layer, such that signals of the electronic element can be directly transmitted to an optical fiber via the external contact area of the photonic element to achieve the purpose of photoelectric integration.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: A voltage regulator circuit comprises an amplifier having an inverting input and a non-inverting input. The amplifier is configured to generate a control signal based on a reference signal at the inverting input of the amplifier and a feedback signal at the non-inverting input of the amplifier. The voltage regulator circuit also comprises an output node, a first power node, a second power node, and a driver that generates a driving current flowing toward the output node in response to the control signal. The driver is coupled between the first power node and the output node. A first transistor having a gate is coupled between the output node and the second power node. A bias circuit outside the amplifier supplies a bias signal to the gate of the first transistor, which is configured to operate in a saturation mode based on the bias signal supplied by the bias circuit.

Abstract: A driver includes a first driver stage having a first T-coil structure. The first T-coil structure includes a first set of inductors each being operable to provide a first inductance. The first T-coil structure further includes a second set of inductors electrically coupled with the first set of inductors, wherein the second set of inductors each are operable to provide a second inductance.

Abstract: A method of making a level shifter includes coupling a driver stage between an input end and an output end, the driver stage comprising a first transistor and a second transistor. An inverter having an input is coupled with the input end. A third transistor having a gate end is coupled with an output of the inverter, the third transistor having a terminal coupled to a pumped voltage (VPP). Additionally, the method includes coupling a fourth transistor with the output end, the fourth transistor having a terminal coupled to the pumped voltage. A fifth transistor is coupled with the input end, the fifth transistor having a terminal coupled to the third and fourth transistors. A sixth transistor is coupled with the input end, the sixth transistor having a terminal.

Abstract: A driver includes a first driver stage having a first T-coil structure. The first T-coil structure includes a first set of inductors each being operable to provide a first inductance. The first T-coil structure further includes a second set of inductors electrically coupled with the first set of inductors, wherein the second set of inductors each are operable to provide a second inductance.