Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a heat sink with an opening is disposed on an electronic component of a carrier structure, a heat dissipation material is formed in the opening, and a heat dissipation lid is disposed on the opening to cover the heat dissipation material, such that the problem of insufficient heat dissipation due to the loss of the heat dissipation material can be prevented from occurring to the electronic component.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a full-panel wafer is provided and includes a plurality of electronic bodies arranged in an array at intervals, a plurality of trenches are formed across the electronic bodies along a first direction on the full-panel wafer, so that the trenches on a single electronic body are arranged parallel to each other at interval and along a second direction perpendicular to the first direction. Then, in a singulation process, any trench can be selected for cutting to obtain a plurality of electronic elements of a required size. Finally, each of the electronic elements is disposed on a packaging region of a carrier structure, so that each of the electronic elements is electrically connected to at least a portion of electrical contact pads in the packaging region.

Abstract: An electronic package and the manufacturing method thereof are provided, in which a photonic element and an electronic element are embedded in an encapsulation layer, and the photonic element has an external contact area exposed from the encapsulation layer, such that signals of the electronic element can be directly transmitted to an optical fiber via the external contact area of the photonic element to achieve the purpose of photoelectric integration.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: A voltage regulator circuit comprises an amplifier having an inverting input and a non-inverting input. The amplifier is configured to generate a control signal based on a reference signal at the inverting input of the amplifier and a feedback signal at the non-inverting input of the amplifier. The voltage regulator circuit also comprises an output node, a first power node, a second power node, and a driver that generates a driving current flowing toward the output node in response to the control signal. The driver is coupled between the first power node and the output node. A first transistor having a gate is coupled between the output node and the second power node. A bias circuit outside the amplifier supplies a bias signal to the gate of the first transistor, which is configured to operate in a saturation mode based on the bias signal supplied by the bias circuit.

Abstract: A driver includes a first driver stage having a first T-coil structure. The first T-coil structure includes a first set of inductors each being operable to provide a first inductance. The first T-coil structure further includes a second set of inductors electrically coupled with the first set of inductors, wherein the second set of inductors each are operable to provide a second inductance.

Abstract: A method of making a level shifter includes coupling a driver stage between an input end and an output end, the driver stage comprising a first transistor and a second transistor. An inverter having an input is coupled with the input end. A third transistor having a gate end is coupled with an output of the inverter, the third transistor having a terminal coupled to a pumped voltage (VPP). Additionally, the method includes coupling a fourth transistor with the output end, the fourth transistor having a terminal coupled to the pumped voltage. A fifth transistor is coupled with the input end, the fifth transistor having a terminal coupled to the third and fourth transistors. A sixth transistor is coupled with the input end, the sixth transistor having a terminal.

Abstract: A driver includes a first driver stage having a first T-coil structure. The first T-coil structure includes a first set of inductors each being operable to provide a first inductance. The first T-coil structure further includes a second set of inductors electrically coupled with the first set of inductors, wherein the second set of inductors each are operable to provide a second inductance.

Abstract: A driver includes a first driver stage having at least one input node and at least one first output node. The first driver stage includes a T-coil structure that is disposed adjacent to the at least one first output node. The T-coil structure includes a first set of inductors each being operable to provide a first inductance. A second set of inductors are electrically coupled with the first set of inductors in a parallel fashion. The second set of inductors each are operable to provide a second inductance. A second driver stage is electrically coupled with the first driver stage.

Abstract: A voltage regulator circuit comprises an amplifier having an inverting input and a non-inverting input. The amplifier is configured to generate a control signal based on a reference signal at the inverting input of the amplifier and a feedback signal at the non-inverting input of the amplifier. The voltage regulator circuit also comprises an output node, a first power node, a second power node, and a driver that generates a driving current flowing toward the output node in response to the control signal. The driver is coupled between the first power node and the output node. A first transistor having a gate is coupled between the output node and the second power node. A bias circuit outside the amplifier supplies a bias signal to the gate of the first transistor, which is configured to operate in a saturation mode based on the bias signal supplied by the bias circuit.

Abstract: A method of operating a voltage regulator circuit includes generating a control signal by an amplifier of the voltage regulator circuit. The control signal is generated based on a reference signal at an inverting input of the amplifier and a feedback signal at a non-inverting input of the amplifier. A driving current flowing toward an output node of the voltage regulator circuit is generated by a driver responsive to the control signal, and the driver is coupled between a first power node and the output node. The feedback signal is generated responsive to a voltage level at the output node. A transistor, coupled between the output node and a second power node, is caused to operate in saturation mode during a period while the voltage regulator circuit is operating.

Abstract: A circuit includes a comparator, a first circuit, and a second circuit. The comparator includes a first input node, a second input node, and an output node. The first circuit is configured to generate a temperature-dependent reference current at the second input node of the comparator. The second circuit is coupled with the second input node of the comparator. The second circuit is configured to increase a voltage level at the second input node of the comparator in response to the temperature-dependent reference current when a signal at the output node of the comparator indicates a first comparison result, and decrease the voltage level at the second input node of the comparator when the signal at the output node of the comparator indicates a second comparison result.

Abstract: A method of making a level shifter includes coupling a driver stage between an input end and an output end, the driver stage comprising a first transistor and a second transistor. An inverter having an input is coupled with the input end. A third transistor having a gate end is coupled with an output of the inverter, the third transistor having a terminal coupled to a pumped voltage (VPP). Additionally, the method includes coupling a fourth transistor with the output end, the fourth transistor having a terminal coupled to the pumped voltage. A fifth transistor is coupled with the input end, the fifth transistor having a terminal coupled to the third and fourth transistors. A sixth transistor is coupled with the input end, the sixth transistor having a terminal.