Patents by Inventor Chiao-Cheng Chang
Chiao-Cheng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180303012Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.Type: ApplicationFiled: January 2, 2018Publication date: October 18, 2018Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yung-Lin Chia
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Patent number: 10104817Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.Type: GrantFiled: January 2, 2018Date of Patent: October 16, 2018Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yung-Lin Chia
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Patent number: 10039185Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.Type: GrantFiled: April 15, 2016Date of Patent: July 31, 2018Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20180160533Abstract: A multilayer printed circuit board includes a first circuit board, a second circuit board and bonding films. The first circuit board includes a first dielectric layer, a first wiring pattern layer, a plurality of conductive blocks and a plurality of solder balls. The first wiring pattern layer is formed on a first surface of the first dielectric layer and the conductive blocks are formed on a second surface of the first dielectric layer. The solder balls are formed on a surface of the first wiring pattern layer. The second circuit board includes a second dielectric layer, a second wiring pattern layer, second conductive blocks and conductive pillars. The second wiring pattern layer is formed on a third surface of the second dielectric layer and the second conductive blocks are formed on a fourth surface thereof. The conductive pillars are formed on the second wiring pattern layer.Type: ApplicationFiled: December 5, 2016Publication date: June 7, 2018Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao LIN, Chiao-Cheng CHANG, Yi-Nong LIN
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Publication number: 20180132349Abstract: A manufacturing method of a double layer circuit board comprises forming at least one connecting pillar on a first circuit, wherein the at least one connecting pillar comprises a first end, connected to the first circuit, and a second end, opposite to the first end; forming a substrate on the first circuit and the at least one connecting pillar; drilling the substrate to expose a portion of the second end of the at least one connecting pillar, wherein the other portion of the second end of the at least one connecting pillar is covered by the substrate; and forming a second circuit on the substrate and the portion of the second end of the at least one connecting pillar, wherein an area of the first end connected to the first circuit layer is greater than an area of the portion of the second end connected to the second circuit layer.Type: ApplicationFiled: January 8, 2018Publication date: May 10, 2018Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20180132351Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.Type: ApplicationFiled: January 5, 2018Publication date: May 10, 2018Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Patent number: 9967975Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.Type: GrantFiled: April 29, 2016Date of Patent: May 8, 2018Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20180068777Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.Type: ApplicationFiled: November 13, 2017Publication date: March 8, 2018Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Patent number: 9901016Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. A protective layer, an antirust layer, and a shielding layer are sequentially mounted on the conductive paste. The EMI shielding device is mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.Type: GrantFiled: April 14, 2017Date of Patent: February 20, 2018Assignee: Kinsus Interconnect Technology Corp.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yung-Lin Chia
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Patent number: 9847165Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.Type: GrantFiled: October 8, 2015Date of Patent: December 19, 2017Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170318671Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.Type: ApplicationFiled: April 29, 2016Publication date: November 2, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170311443Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.Type: ApplicationFiled: April 26, 2016Publication date: October 26, 2017Inventors: Ting-Hao LIN, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170303397Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.Type: ApplicationFiled: April 15, 2016Publication date: October 19, 2017Inventors: Ting-Hao LIN, Chiao-Cheng CHANG, Yi-Nong LIN
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Publication number: 20170299632Abstract: A printed circuit board (PCB) test fixture includes a substrate, a first insulation layer formed on the substrate, a conductor layer formed on the first insulation layer and electrically connected to the upper electrodes through at least one first connection member, a second insulation layer formed on the first insulation layer, and multiple conductive cones arranged on the second insulation layer in a matrix form. A part of the conductive cones is electrically connected to the conductor layer through at least one second connection member. The circuit layout of the conductor layer, the at least one first connection member and the at least one second connection member is employed to supply testing power to a part of the conductive cones and an adjustable arrangement of the conductive cones to enhance density of test probes upon electrical testing.Type: ApplicationFiled: April 17, 2016Publication date: October 19, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170287617Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.Type: ApplicationFiled: March 31, 2016Publication date: October 5, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170140857Abstract: Disclosed is a modified magnetic coil structure. A substrate, at least one circuit pattern layer and a permeability enforced ring are included. The substrate is formed of an electrical insulation material, and has a through hole. The circuit pattern layer is formed of an electrically conductive material and configured in the substrate to surround but not contact the through hole. The permeability enforced ring is formed of a high permeability material and provided in the through hole so as to fully cover a sidewall of the through hole. The permeability enforced ring and the substrate form two co-planes in an upper horizontal plane and a lower horizontal plane of the modified magnetic coil structure, respectively. Therefore, the present invention employs the permeability enforced ring to greatly increase magnetic flux density to form a high permeability device, thereby improving the electromagnetic effect and properties of the magnetic coil.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170103844Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.Type: ApplicationFiled: October 8, 2015Publication date: April 13, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Patent number: 9570227Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.Type: GrantFiled: July 27, 2015Date of Patent: February 14, 2017Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20170032881Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.Type: ApplicationFiled: July 27, 2015Publication date: February 2, 2017Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
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Publication number: 20160262269Abstract: Disclosed is a copper etching method for manufacturing a circuit board, including steps of electroplating a metal copper support layer, coating a thermal sensitive photo resist layer, coating a photo resist layer, performing a process of pattern transfer, removing part of the photo resist layer to form a photo resist pattern, electroplating a metal copper layer to form a circuit pattern, peeling off the photo resist layer, pressing a stacked body composed of a stacked substrate and a stacked material layer onto the circuit pattern to embed the circuit pattern in the stacked material layer, removing the base layer, performing a copper etching process to removing the metal copper support layer, and removing the thermal sensitive photo resist layer to expose the circuit pattern. In particular, the circuit pattern protrudes from the stacked material layer so as to facilitate the subsequent process of forming solder balls.Type: ApplicationFiled: March 6, 2015Publication date: September 8, 2016Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin