Abstract: A light emitting diode (LED) has a leadframe, at least one LED chip and an encapsulant. The leadframe has a first and a second pin each having an upper sealed portion and a bottom exposed portion. The upper sealed portion on which the LED chip is mounted is covered by the encapsulant. The bottom exposed portion is composed of a neck and a longitudinal conductor. The neck is larger than the longitudinal conductor to increase the surface area and the capability to dissipate heat. The neck may further have a transverse fin to increase the surface area and heat dissipation. Therefore, the present invention has a good heat-dissipating capability.