Patents by Inventor Chiao-Pei Chen

Chiao-Pei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Testing substrate and manufacturing method thereof and probe card
    Patent number: 12108543
    Abstract: A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: October 1, 2024
    Assignee: HERMES TESTING SOLUTIONS INC.
    Inventors: Chiao-Pei Chen, Chun-Hsiung Chou
  • TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD
    Publication number: 20230217600
    Abstract: A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.
    Type: Application
    Filed: March 9, 2022
    Publication date: July 6, 2023
    Applicant: HERMES TESTING SOLUTIONS INC.
    Inventors: Chiao-Pei Chen, Chun-Hsiung Chou
  • POLYIMIDE PRECURSOR AND LITHOGRAPHY PATTERN FORMED BY THE SAME
    Publication number: 20190163061
    Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.
    Type: Application
    Filed: February 28, 2018
    Publication date: May 30, 2019
    Inventors: Chi-Shian CHEN, Bin-Ling TSAI, Yu-Pei CHEN, Chiao-Pei CHEN, Yu-Fu LIAO, Shih-Chang LIN, Chen-Ni CHEN, Tsung-Tai HUNG, Chiu-Feng CHEN
  • Polyimide polymer, polyimide film, and flexible copper-coated laminate
    Patent number: 9955572
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: April 24, 2018
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • ADHESIVE COMPOSITION AND LAMINATED FILM
    Publication number: 20180086952
    Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).
    Type: Application
    Filed: November 22, 2016
    Publication date: March 29, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: I-Ling Teng, Tzu-Ching Hung, Chiao-Pei Chen, Yu-Hsien Lee, Tsung-Tai Hung, Bo-Sheng Wang, Cheng-Yen Hsiao, Chen-Hsin Huang
  • POLYIMIDE AND POLYIMIDE FILM
    Publication number: 20170152348
    Abstract: A polyimide is provided. The polyimide includes a repeating unit represented by formula 1.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 1, 2017
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Pin-Shiuan Chen, Ching-Hung Huang
  • POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE
    Publication number: 20170034910
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Application
    Filed: October 18, 2016
    Publication date: February 2, 2017
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • Polyimide polymer, polyimide film, and flexible copper-coated laminate
    Patent number: 9505887
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: November 29, 2016
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE
    Publication number: 20160115277
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 28, 2016
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang