Abstract: A pretreatment process of a substrate in a micro/nano imprinting technology is disclosed, comprising deposing the substrate on a holder and performing a plasma treatment or an ion treatment on the substrate. In the plasma treatment of the substrate, a reactive gas is first injected into the chamber to form a plasma, such that the plasma causes a physical reaction and a chemical reaction on the substrate to activate the substrate surface and also remove particles and contaminants adhering to the substrate surface. When the ion treatment is performed on the substrate, an ion source is placed into the chamber and ions and neutral atoms generated by the ion source bombard the substrate, causing a physical reaction and a chemical reaction on the substrate to activate the substrate surface and also remove particles and contaminants adhering to the substrate surface.