Abstract: A transmission method for increasing a transmission throughput of a communication device includes: receiving a wireless signal, wherein the wireless signal includes a received packet; determining whether the received packet is from an overlapping basic service set (OBSS), and determining a length of a duration of a transmission opportunity (TXOP) according to information carried by the received packet; in response to the received packet being from the OBSS, performing packet transmission in a spatial reuse manner within the duration of the TXOP; and performing the packet transmission in a general manner after the duration of the TXOP ends; wherein a transmission power utilized in the spatial reuse manner is different from a transmission power utilized in the general manner, and a plurality of packets are transmitted in the spatial reuse manner within the duration of the TXOP.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

Abstract: A method is described for driving light emission of a light emitting device that includes first and second electrode layers, and first and second groups of light emitting diodes between the first and second electrode layers. A first electrode voltage is provided to the first and second electrode layers to conduct the first group of light emitting diodes, and then a second electrode voltage is provided to the first and second electrode layers to conduct the second group of light emitting diodes.

Abstract: An illumination device includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element. The lamp seat includes a light exiting mount region. The primary circuit is disposed on the circuit board. The secondary circuit is disposed at the light exiting mount region. The conductive wires electrically connect the primary and secondary circuits. The light-emitting element is disposed at the light exiting mount region and is electrically connected to the secondary circuit. Another illumination device is also provided, which includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer, a circuit pattern layer, and at least one light emitting diode (LED) chip. The electrically insulating layer is partially formed on the heat sinking substrate so as to expose a portion of the heat sinking substrate. The circuit pattern layer is formed on the electrically insulating layer. The LED chip is electrically connected to the circuit pattern layer, and is indirectly and non-electrically mounted to the portion of the heat sinking substrate exposed from the electrically insulating layer and the circuit pattern layer. A method of making the light emitting device is also provided.

Abstract: A manufacturing method of a phase retarding film, a manufacturing method of a stereoscopic display apparatus, and a phase retarding film are provided. A light transmissive substrate is provided. An alignment layer is formed on the light-transmissive substrate. The alignment layer is aligned. A birefringent material film is formed on the alignment layer. A reaction-causing light is used to expose a first patterned region of the birefringent material film to induce a reaction on the first patterned region, wherein a second patterned region of the biregringent material film is not exposed to the reaction-causing light. The second patterned region of the biregringent material film is removed.

Abstract: A manufacturing method of a phase retardation film is provided. A flexible light-transmissive substrate is provided. The flexible light-transmissive substrate is aligned to form an alignment substrate. A birefringent material film is formed on the alignment substrate. A reaction-causing light is used to expose and induce a reaction on a first patterned region of the birefringent material film. A second patterned region of the birefringent material film is not exposed by the reaction-causing light. The second patterned region of the birefringent material film is removed. A manufacturing system configured to produce a phase retardation film is also provided.

Abstract: A manufacturing method of a phase retarding film, a manufacturing method of a stereoscopic display apparatus, and a phase retarding film are provided. A light transmissive substrate is provided. An alignment layer is formed on the light-transmissive substrate. The alignment layer is aligned. A birefringent material film is formed on the alignment layer. A reaction-causing light is used to expose a first patterned region of the birefringent material film to induce a reaction on the first patterned region, wherein a second patterned region of the biregringent material film is not exposed to the reaction-causing light. The second patterned region of the biregringent material film is removed.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: An ink jet head structure and an adhering method thereof are provided. The ink jet head structure has ink accommodated therein, and the ink is jetted with the operation of the actuator. The ink jet head structure includes a first substrate, a second substrate, and a third substrate sandwiched between the first and the second substrates. A first fluid passage is formed between the first and the third substrates, and a second fluid passage is formed between the second and the third substrates. By injecting glue between the first and the second fluid passages, the first, second and third substrates are bonded. When the actuator operates, the reservoir disposed in the three substrates may jet the ink accommodated therein from the ink outlet thereof, thereby achieving the purpose of easy bonding and ink jetting.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: An apparatus of manufacturing a biochip and manufacture method of biochip tip array. The invention provides an apparatus for manufacturing a biochip from a substrate. The apparatus comprises a tip array, a reservoir tank and a conduit connecting the tip array and the reservoir tank. When the substrate is placed over the tip array, the agent in the reservoir tank can be applied to the substrate by moving upward and downward the reservoir tank with respect to the tip array.

Abstract: An ink jet head structure and an adhering method thereof are provided. The ink jet head structure has ink accommodated therein, and the ink is jetted with the operation of the actuator. The ink jet head structure includes a first substrate, a second substrate, and a third substrate sandwiched between the first and the second substrates. A first fluid passage is formed between the first and the third substrates, and a second fluid passage is formed between the second and the third substrates. By injecting glue between the first and the second fluid passages, the first, second and third substrates are bonded. When the actuator operates, the reservoir disposed in the three substrates may jet the ink accommodated therein from the ink outlet thereof, thereby achieving the purpose of easy bonding and ink jetting.

Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: A porous back-shooting inkjet print head module is disclosed. The ink permeates through the porous ink supply layer into an ink chamber in contact with the outside by an injection hole, and the porous ink supply layer prevents the ink from flowing back. Therefore, the ink chamber is sealed very well and more pressure could be generated. The invention can thus be used for inks with high viscosities. It does not need a precision alignment process as in the prior art. This does not only increase the efficiency and yield of production, but also reduces the cost.

Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.

Abstract: A porous back-shooting inkjet print head module is disclosed. The ink permeates through the porous ink supply layer into an ink chamber in contact with the outside by an injection hole, and the porous ink supply layer prevents the ink from flowing back. Therefore, the ink chamber is sealed very well and more pressure could be generated. The invention can thus be used for inks with high viscosities. It does not need a precision alignment process as in the prior art. This does not only increase the efficiency and yield of production, but also reduces the cost.