Patents by Inventor Chia-Tai Chen

Chia-Tai Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921947
    Abstract: A touch function setting method is provided. The method comprising: receiving a sequence parameter which includes multiple clicks, each of the clicks is corresponding to one of areas of a touch panel or screen; receiving a function parameter corresponding to the sequence parameter, the function parameter is corresponding to activate a function; and storing a group of touch function parameters, which includes the sequence parameter and the function parameter.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: March 5, 2024
    Assignee: EGALAX_EMPIA TECHNOLOGY INC.
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Chia-Ling Sun, Jia-Ming Chen
  • Patent number: 10446731
    Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: October 15, 2019
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi Liao, Chia-Tai Chen, Wen-Chia Tsai, Jing-Yi Yang, Ai-Ling Lin
  • Publication number: 20190074421
    Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.
    Type: Application
    Filed: November 6, 2018
    Publication date: March 7, 2019
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO. LTD.
    Inventors: Pen-Yi LIAO, Chia-Tai CHEN, Wen-Chia TSAI, Jing-Yi YANG, Ai-Ling LIN
  • Publication number: 20180014372
    Abstract: A method is described for driving light emission of a light emitting device that includes first and second electrode layers, and first and second groups of light emitting diodes between the first and second electrode layers. A first electrode voltage is provided to the first and second electrode layers to conduct the first group of light emitting diodes, and then a second electrode voltage is provided to the first and second electrode layers to conduct the second group of light emitting diodes.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 11, 2018
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Chia-Tai CHEN, Sheng-Hung YI, Pen-Yi LIAO
  • Publication number: 20170328552
    Abstract: An illumination device includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element. The lamp seat includes a light exiting mount region. The primary circuit is disposed on the circuit board. The secondary circuit is disposed at the light exiting mount region. The conductive wires electrically connect the primary and secondary circuits. The light-emitting element is disposed at the light exiting mount region and is electrically connected to the secondary circuit. Another illumination device is also provided, which includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 16, 2017
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Chia-Tai CHEN, Sheng-Hung YI, Pen-Yi LIAO
  • Publication number: 20170194544
    Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer, a circuit pattern layer, and at least one light emitting diode (LED) chip. The electrically insulating layer is partially formed on the heat sinking substrate so as to expose a portion of the heat sinking substrate. The circuit pattern layer is formed on the electrically insulating layer. The LED chip is electrically connected to the circuit pattern layer, and is indirectly and non-electrically mounted to the portion of the heat sinking substrate exposed from the electrically insulating layer and the circuit pattern layer. A method of making the light emitting device is also provided.
    Type: Application
    Filed: December 28, 2016
    Publication date: July 6, 2017
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi LIAO, Chia-Tai CHEN, Wen-Chia TSAI, Jing-Yi YANG, Ai-Ling LIN
  • Patent number: 8797483
    Abstract: A manufacturing method of a phase retarding film, a manufacturing method of a stereoscopic display apparatus, and a phase retarding film are provided. A light transmissive substrate is provided. An alignment layer is formed on the light-transmissive substrate. The alignment layer is aligned. A birefringent material film is formed on the alignment layer. A reaction-causing light is used to expose a first patterned region of the birefringent material film to induce a reaction on the first patterned region, wherein a second patterned region of the biregringent material film is not exposed to the reaction-causing light. The second patterned region of the biregringent material film is removed.
    Type: Grant
    Filed: May 22, 2011
    Date of Patent: August 5, 2014
    Assignee: Industrial Technology Research Institute
    Inventor: Chia-Tai Chen
  • Publication number: 20140091056
    Abstract: A manufacturing method of a phase retardation film is provided. A flexible light-transmissive substrate is provided. The flexible light-transmissive substrate is aligned to form an alignment substrate. A birefringent material film is formed on the alignment substrate. A reaction-causing light is used to expose and induce a reaction on a first patterned region of the birefringent material film. A second patterned region of the birefringent material film is not exposed by the reaction-causing light. The second patterned region of the birefringent material film is removed. A manufacturing system configured to produce a phase retardation film is also provided.
    Type: Application
    Filed: November 29, 2013
    Publication date: April 3, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Tai Chen, Po-Fu Yen
  • Publication number: 20120242949
    Abstract: A manufacturing method of a phase retarding film, a manufacturing method of a stereoscopic display apparatus, and a phase retarding film are provided. A light transmissive substrate is provided. An alignment layer is formed on the light-transmissive substrate. The alignment layer is aligned. A birefringent material film is formed on the alignment layer. A reaction-causing light is used to expose a first patterned region of the birefringent material film to induce a reaction on the first patterned region, wherein a second patterned region of the biregringent material film is not exposed to the reaction-causing light. The second patterned region of the biregringent material film is removed.
    Type: Application
    Filed: May 22, 2011
    Publication date: September 27, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Chia-Tai Chen
  • Patent number: 7914123
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: March 29, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Patent number: 7631959
    Abstract: An ink jet head structure and an adhering method thereof are provided. The ink jet head structure has ink accommodated therein, and the ink is jetted with the operation of the actuator. The ink jet head structure includes a first substrate, a second substrate, and a third substrate sandwiched between the first and the second substrates. A first fluid passage is formed between the first and the third substrates, and a second fluid passage is formed between the second and the third substrates. By injecting glue between the first and the second fluid passages, the first, second and third substrates are bonded. When the actuator operates, the reservoir disposed in the three substrates may jet the ink accommodated therein from the ink outlet thereof, thereby achieving the purpose of easy bonding and ink jetting.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: December 15, 2009
    Assignee: Industrial Technology Research Institute
    Inventor: Chia-Tai Chen
  • Publication number: 20090273648
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Application
    Filed: July 9, 2009
    Publication date: November 5, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Patent number: 7600859
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: October 13, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Publication number: 20080035485
    Abstract: An apparatus of manufacturing a biochip and manufacture method of biochip tip array. The invention provides an apparatus for manufacturing a biochip from a substrate. The apparatus comprises a tip array, a reservoir tank and a conduit connecting the tip array and the reservoir tank. When the substrate is placed over the tip array, the agent in the reservoir tank can be applied to the substrate by moving upward and downward the reservoir tank with respect to the tip array.
    Type: Application
    Filed: October 19, 2006
    Publication date: February 14, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Chia-Tai Chen
  • Publication number: 20080024564
    Abstract: An ink jet head structure and an adhering method thereof are provided. The ink jet head structure has ink accommodated therein, and the ink is jetted with the operation of the actuator. The ink jet head structure includes a first substrate, a second substrate, and a third substrate sandwiched between the first and the second substrates. A first fluid passage is formed between the first and the third substrates, and a second fluid passage is formed between the second and the third substrates. By injecting glue between the first and the second fluid passages, the first, second and third substrates are bonded. When the actuator operates, the reservoir disposed in the three substrates may jet the ink accommodated therein from the ink outlet thereof, thereby achieving the purpose of easy bonding and ink jetting.
    Type: Application
    Filed: October 6, 2006
    Publication date: January 31, 2008
    Inventor: Chia-Tai Chen
  • Patent number: 7108961
    Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: September 19, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ming Huang, Chia-Tai Chen, Yu-Hung Chuang, Jian-Chiun Lion, Chien-Hung Liu, Chun-Jung Chen
  • Publication number: 20050134646
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Application
    Filed: March 8, 2004
    Publication date: June 23, 2005
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Patent number: 6886925
    Abstract: A porous back-shooting inkjet print head module is disclosed. The ink permeates through the porous ink supply layer into an ink chamber in contact with the outside by an injection hole, and the porous ink supply layer prevents the ink from flowing back. Therefore, the ink chamber is sealed very well and more pressure could be generated. The invention can thus be used for inks with high viscosities. It does not need a precision alignment process as in the prior art. This does not only increase the efficiency and yield of production, but also reduces the cost.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: May 3, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Tai Chen, Shyh-Haur Su, Chi-Ming Huang, Jinn-Cherng Yang, Chun-Jung Chen, Je-Ping Hu
  • Publication number: 20050045582
    Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
    Type: Application
    Filed: November 7, 2003
    Publication date: March 3, 2005
    Inventors: Chi-Ming Huang, Chia-Tai Chen, Yu-Hung Chuang, Jian-Chiun Lion, Chien-Hung Liu, Chun-Jung Chen
  • Publication number: 20040130603
    Abstract: A porous back-shooting inkjet print head module is disclosed. The ink permeates through the porous ink supply layer into an ink chamber in contact with the outside by an injection hole, and the porous ink supply layer prevents the ink from flowing back. Therefore, the ink chamber is sealed very well and more pressure could be generated. The invention can thus be used for inks with high viscosities. It does not need a precision alignment process as in the prior art. This does not only increase the efficiency and yield of production, but also reduces the cost.
    Type: Application
    Filed: January 6, 2003
    Publication date: July 8, 2004
    Inventors: Chia-Tai Chen, Shyh-Haur Su, Chi-Ming Huang, Jinn-Cherng Yang, Chun-Jung Chen, Je-Ping Hu