Abstract: A method for the surface treatment of a corrosion-resistant nickel-based alloy and the resulting surface structure of the treated alloy is disclosed. The method includes immersing a nickel-based alloy in a first neutral or alkaline solution to remove surface contaminants, followed by immersing the cleaned alloy in a second neutral or alkaline solution to form functional groups on its surface. Subsequently, a low-temperature heat treatment is performed to form a passivation layer on the surface of the nickel-based alloy. The passivation layer has a surface roughness of less than 0.04 microns and a thickness ranging from 5 nanometers to 200 nanometers. The resulting corrosion-resistant nickel-based alloy comprises a substrate made of the nickel-based alloy and a passivation layer established on at least one surface of the substrate. The nickel content of the alloy is greater than 50%, and the alloy may also contain additional metallic components such as chromium (Cr) and manganese (Mn).

Abstract: This disclosure is related to an ultraviolet fluid sterilizing box structure. A box (10) includes a chamber (100), a water inlet (101) and a water outlet (102). The water inlet (101) and the water outlet (102) are located on different sides of the box (10). The partition (20) is disposed in the chamber (100) and includes an outer cylinder (21) and an inner cylinder (22). The outer cylinder (21) includes an outer cavity (210) and an inflow inlet (211). The inner cylinder (22) includes an inner cavity (220) and an opening (221). The ultraviolet module (30) is disposed on one side of the box (10) and includes a light-transmitting plate (31) and an ultraviolet lamp set (32). The light-transmitting plate (31) seals the outer cylinder (21). The ultraviolet rays irradiate the inner cavity (220) and the outer cavity (210).

Abstract: This disclosure provides a rotary ultraviolet sterilizing box. A circuit board is disposed in the box. A rotary plate structure includes a motor and a carrier plate. The motor is disposed on a bottom of the box and electrically connected to the circuit board. The carrier plate is disposed in the box and driven by the motor to rotate. A linear LED light strip is arranged on an inner wall of the box and electrically connected to the circuit board. The linear LED light strip includes a plurality of ultraviolet LEDs arranged linearly and spacedly.

Abstract: The invention is a UV sterilizing box structure. A box body has a round chamber, an inlet, and an outlet. The round chamber is formed with an arc-shaped guiding channel. A UV light module is disposed on a side of the box body. An external fluid enters the round chamber via the inlet and spirally flows through an inside of the round chamber along the arc-shaped guiding channel so as to make the fluid in the box body generate a flow with a specific direction and stay for enough time to be sufficiently irradiated by UV rays. Thereby, a better effect of sterilization may be obtained.

Abstract: The invention is a UV sterilizing box structure. A box body has a round chamber, an inlet, and an outlet. The round chamber is formed with an arc-shaped guiding channel. A UV light module is disposed on a side of the box body. An external fluid enters the round chamber via the inlet and spirally flows through an inside of the round chamber along the arc-shaped guiding channel so as to make the fluid in the box body generate a flow with a specific direction and stay for enough time to be sufficiently irradiated by UV rays. Thereby, a better effect of sterilization may be obtained.

Abstract: An ultraviolet LED module and a container having the same are disclosed. The container includes a container cover, a container main body, and an ultraviolet LED module disposed on the container cover. The ultraviolet LED module includes: a case body, having a penetrated hole and not provided with a concave cup; an ultraviolet LED main body, having a LED die exposed in the penetrated hole; a waterproof and dustproof adhesive, filled in a gap between the ultraviolet LED main body and the case body for waterproofing and dustproofing; and an enclosing lens, enclosing the LED die; wherein ultraviolet generated by the LED die emits out from the penetrated hole through the enclosing lens. Accordingly, a power impairment of ultraviolet emitted by the LED die can be as lower as possible.

Abstract: The LED lamp includes a heat dissipating base, an LED module, a hood and a sealant. The heat dissipating base has a mount board including a first surface and a second surface. The first and second surfaces are provided with an annular trough and fins, respectively. The LED module is fixed on the mount board and surrounded by the annular trough. The hood is formed with a flange which is embedded into the annular trough to cloak the LED module. The sealant is filled in the annular trough to seal up.

Abstract: The LED lamp includes a heat dissipating base, an LED module, a hood and a sealant. The heat dissipating base has a mount board including a first surface and a second surface. The first and second surfaces are provided with an annular trough and fins, respectively. The LED module is fixed on the mount board and surrounded by the annular trough. The hood is formed with a flange which is embedded into the annular trough to cloak the LED module. The sealant is filled in the annular trough to seal up.

Abstract: An apparatus and a method for compensating uniformity of film thickness are provided. A shielding plate is provided between a vapor deposition object and a evaporation source. During the vapor deposition process, a shielding plate is continuously moved according to film deposition rates, so as to selectively pass or block atoms emitted from the evaporation source to achieve purpose of adjustably depositing.

Abstract: A projection apparatus including an illumination system, a reflective light valve, a projection lens, and a color filter is provided. The illumination system has a light source for providing an illumination beam, and the reflective light valve is disposed on the transmission path of the illumination beam. The reflective light valve has a plurality of pixels arranged in an array for converting the illumination beam into an image, and the projection lens is disposed on the transmission path of the image. The color filter is disposed between the light source and the reflective light valve and on the transmission path of the illumination beam. Moreover, the color filter includes a transparent substrate and a color filter array disposed on a first surface of the transparent substrate. The color filter array includes a plurality of filter patterns, and each of the filter patterns corresponds to one of the pixels, respectively.

Abstract: A multi-primary-color light splitting and combining system, includes a dichroic device, receiving an incident light beam and splitting into a first light beam having a first wavelength range and a second light beam having a second wavelength range. The first wavelength range in wavelength value is larger than the second wavelength range. A first polarized beam splitter receives the first light beam and splits out a first polarization beam having a first predetermined polarization state. A second polarized beam splitter receives the second light beam and splits out a second polarization beam having a second predetermined polarization state. A first and a second reflective displaying panels respectively receive the first and second polarization light beams, and reflect first and second sets of image information with respect to multiple primary colors. A polarized beam splitter combines first and second sets of image information to form an image light beam.

Abstract: A light emitting module includes a heat dissipation base, a circuit board and a light emitting diode (LED) package. The supporting surface of the heat dissipation base has a positioning structure. The circuit board is disposed on the supporting surface of the heat dissipation base, and it has an opening for exposing the positioning structure. The LED package is positioned at the positioning structure through the opening and is electrically connected to the circuit board.

Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided. An end of the holder is connected to the base, and the light emitting device includes a lampshade pivotally connected to another end of the holder, a reflecting thin film and an LED light module. The lampshade has at least a side-wall and a top-wall connected the side-wall. The reflecting thin film is disposed on the top-wall and the LED light module is disposed in the side-wall. The light emitted from the LED light module is reflected several times by the reflecting thin film to render the brightness of the light emitted out of the lampshade substantially uniform.

Abstract: A thermally enhanced battery module including a casing, at least a cell and a heat dissipation fin is provided. The casing has at least an opening, and the cell and the heat dissipation fin are both disposed in the casing. The cell has a contact surface, and the heat dissipation fin has an inner surface and an outer surface. Part of the inner surface contacts the contact surface of the cell. The outer surface has a plurality of notches and contacts the casing. At least one notch is exposed through the opening. The heat generated by the cell is capable of being dissipated by the heat dissipation fin and the opening in the invention to avoid overheating or decreasing the charging or discharging efficiency.

Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided. An end of the holder is connected to the base, and the light emitting device includes a lampshade pivotally connected to another end of the holder, a reflecting thin film and an LED light module. The lampshade has at least a side-wall and a top-wall connected the side-wall. The reflecting thin film is disposed on the top-wall and the LED light module is disposed in the side-wall. The light emitted from the LED light module is reflected several times by the reflecting thin film to render the brightness of the light emitted out of the lampshade substantially uniform.

Abstract: A vehicle headlamp is provided. The vehicle headlamp includes a lampshade, a lamp base provided at the lampshade, a light source module provided at the lamp base, a light source adjusting mechanism connected between the lampshade and the lamp base and a heat dissipation module. Wherein, lampshade has an opening, and the light source adjusting mechanism can adjust the relative position between the lampshade and the lamp base. In addition, the heat dissipation module provided between the light source module and the lamp base can extend to the external side of the lampshade via the opening.

Abstract: A light emitting diode (LED) table lamp including a base, a support arm, a pivot, and a light emitting device is provided. One end of the support arm is connected to the base, and the pivot is provided at the other end of the support arm. The light emitting device includes a lampshade, a LED light assembly provided at the lampshade, and at least a heat pipe. The lampshade is pivotally connected to the support arm by the pivot, and the heat pipe is provided at the LED light assembly. In addition, an end of the heat pipe is tightly fitted with the pivot.

Abstract: An apparatus and a method for compensating uniformity of film thickness are provided. A shielding plate is provided between a vapor deposition object and a evaporation source. During the vapor deposition process, a shielding plate is continuously moved according to film deposition rates, so as to selectively pass or block atoms emitted from the evaporation source to achieve purpose of adjustably depositing.

Abstract: A heat dissipation module including a base, a heat pipe and a fastener is provided. The base has a holding space, and the heat pipe is provided through the holding space. In addition, the fastener is inserted into the holding space. The fastener includes a body and at least an elastomer extending from the body, wherein the elastomer is suitable to press against the heat pipe to make the heat pipe tightly assembled with the base.

Abstract: A method of packaging light emitting diodes includes providing a wafer having a plurality of LEDs thereon, forming at least a sealant surrounding the LEDs, providing a glass substrate to cover the LEDs, the sealant, and the wafer, providing a UV hardening process to harden the sealant, forming a polarization film on the glass substrate, and dicing the wafer.