Patents by Inventor Chiau Jin Lee
Chiau Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9882094Abstract: A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.Type: GrantFiled: March 14, 2011Date of Patent: January 30, 2018Assignee: INTELLECTUAL DISCOVERY CO., LTD.Inventors: Keat Chuan Ng, Norfidathul Aizar Abdul Karim, Chiau Jin Lee
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Patent number: 9269875Abstract: A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees.Type: GrantFiled: May 20, 2009Date of Patent: February 23, 2016Assignee: INTELLECTUAL DISCOVERY CO., LTD.Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
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Patent number: 9231176Abstract: The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.Type: GrantFiled: September 25, 2013Date of Patent: January 5, 2016Assignee: Intellectual Discovery Co., Ltd.Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
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Patent number: 9135837Abstract: A reflector housing having a plurality of cavities formed therein, and a plurality of light emitters mounted in the plurality of cavities. Each of the plurality of cavities contains a single one of the plurality of light emitters.Type: GrantFiled: November 16, 2007Date of Patent: September 15, 2015Assignee: Intellectual Discovery Co., Ltd.Inventors: Yean Chon Yaw, Kum Soon Wong, Chiau Jin Lee
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Patent number: 9105825Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.Type: GrantFiled: June 3, 2013Date of Patent: August 11, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Kheng Leng Tan
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Publication number: 20140353701Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.Type: ApplicationFiled: June 3, 2013Publication date: December 4, 2014Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Kheng Leng Tan
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Publication number: 20140175486Abstract: The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.Type: ApplicationFiled: September 25, 2013Publication date: June 26, 2014Applicant: INTELLECTUAL DISCOVERY CO., LTD.Inventors: Eng Chuan ONG, Meng Ee LEE, Chiau Jin LEE
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Patent number: 8569778Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package enables a narrow viewing angle without requiring a second lens. In particular, the PLCC package is provided with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.Type: GrantFiled: February 11, 2011Date of Patent: October 29, 2013Assignee: Intellectual Discovery Co., Ltd.Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
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Patent number: 8405181Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package provides a light source that is both high contrast and high brightness. Specifically, the PLCC package includes a reflector cup whose surface area is partially inclusive of a lead frame and partially inclusive of a plastic housing that surrounds the lead frame.Type: GrantFiled: March 16, 2011Date of Patent: March 26, 2013Assignee: Intellectual Discovery Co., Ltd.Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 8356917Abstract: An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.Type: GrantFiled: August 19, 2009Date of Patent: January 22, 2013Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Aizar Abdul Karim Norfidathul
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Publication number: 20120235287Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package provides a light source that is both high contrast and high brightness. Specifically, the PLCC package includes a reflector cup whose surface area is partially inclusive of a lead frame and partially inclusive of a plastic housing that surrounds the lead frame.Type: ApplicationFiled: March 16, 2011Publication date: September 20, 2012Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Keat Chuan Ng
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Publication number: 20120235187Abstract: A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.Type: ApplicationFiled: March 14, 2011Publication date: September 20, 2012Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE)PTE. LTD.Inventors: Keat Chuan Ng, Norfidathul Aizar Abdul Karim, Chiau Jin Lee
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Publication number: 20120211785Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.Type: ApplicationFiled: February 23, 2011Publication date: August 23, 2012Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Keat Chuan Ng, Kheng Leng Tan, Chiau Jin Lee
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Publication number: 20120205693Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package enables a narrow viewing angle without requiring a second lens. In particular, the PLCC package is provided with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.Type: ApplicationFiled: February 11, 2011Publication date: August 16, 2012Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
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Patent number: 8232574Abstract: A surface mount light emitting device package with mechanical latching means for locking a lens on to the package is provided. The surface mount light emitting package may include an encapsulation layer or a lens, a lead frame, at least one lead, a body, a die, and a layer of transparent gel encapsulant material. The lead frame may include at least one protrusion which is bent upward to from at least one latch for engaging the lens.Type: GrantFiled: October 28, 2010Date of Patent: July 31, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan
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Publication number: 20120104436Abstract: A surface mount light emitting device package with mechanical latching means for locking a lens on to the package is provided. The surface mount light emitting package may include an encapsulation layer or a lens, a lead frame, at least one lead, a body, a die, and a layer of transparent gel encapsulant material. The lead frame may include at least one protrusion which is bent upward to from at least one latch for engaging the lens.Type: ApplicationFiled: October 28, 2010Publication date: May 3, 2012Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan
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Publication number: 20120056218Abstract: A lead frame package with multiple bends suitable for a light-emitting device, as well as a non-optical device is disclosed. A light-emitting device incorporating the lead frame package with multiple bends may comprise a light source die, a body and a plurality of leads. A non-optical device incorporating the lead frame package may comprise a die, a body and a plurality of leads. Each of the leads has at least first, second, and third bends defining each of the leads into at least first, second, third and fourth sections. At least the second section, the third section and the second bends of each lead are encapsulated by an encapsulating material forming the body.Type: ApplicationFiled: September 8, 2010Publication date: March 8, 2012Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 8120055Abstract: Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.Type: GrantFiled: April 20, 2009Date of Patent: February 21, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 8115385Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: August 30, 2010Date of Patent: February 14, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20110140133Abstract: The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.Type: ApplicationFiled: December 15, 2010Publication date: June 16, 2011Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Wei Liam Loo, Chiau Jin Lee, Yean Chon Yaw