Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

Abstract: A display device includes a display panel, a back light module, a heat dissipation plate and a heat pipe. The display panel has a display surface. The back light module is coupled to the display panel, and this back light module includes a control circuit board. The heat dissipation plate contacts the control circuit board. The heat pipe contacts the heat dissipation plate. The length direction of the heat pipe is not parallel with a horizontal direction, and it is also not perpendicular to the display surface.

Abstract: A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.