Patents by Inventor Chie HAMADA

Chie HAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260226319
    Abstract: A laminate includes a void-containing layer, and a pressure-sensitive adhesive/adhesive layer directly laminated on one surface or both surfaces of the void-containing layer. The pressure-sensitive adhesive/adhesive layer includes a pressure-sensitive adhesive/adhesive including a (meth)acrylic polymer and an organic silyl group-containing compound. An increase rate of a refractive index of the void-containing layer before and after a heat durability test of holding the laminate at a temperature of 65° C. and a relative humidity of 95% for 500 hours satisfies the following formula (1): (|n?n0|/n0)×100<3.0 (1). In the formula (1), n represents the refractive index of the void-containing layer after the heat durability test, and n0 represents the refractive index of the void-containing layer before the heat durability test.
    Type: Application
    Filed: March 25, 2026
    Publication date: August 6, 2026
    Inventors: Chie HAMADA, Akiko SUGINO
  • Patent number: 12655333
    Abstract: A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5<B/A<900.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: June 16, 2026
    Assignee: NITTO DENKO CORPORATION
    Inventors: Akiko Tanaka, Yuto Suzuki, Chie Hamada
  • Publication number: 20250231337
    Abstract: A sensor package attached to an object contains a first base material; and an optical fiber having an FBG sensor portion disposed on the first base material. The sensor package includes a resin portion located on the first base material, a first adhesive layer located on the first base material to attach the first base material to the object, and a bonding adhesive layer located on a surface of the resin portion on a side opposite to the first base material, and the FBG sensor portion of the optical fiber is in contact with the resin portion and held by the bonding adhesive layer.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 17, 2025
    Inventors: Akiko TANAKA, Chie HAMADA, Yuto SUZUKI, Masahiro WATANABE, Shintaro FUKUMOTO, Takayuki NISHIDO
  • Publication number: 20240409789
    Abstract: A laminate includes: a void-containing layer and a pressure-sensitive adhesive/adhesive layer. The pressure-sensitive adhesive/adhesive layer is directly laminated on one surface or both surfaces of the void-containing layer. The pressure-sensitive adhesive/adhesive layer contains a (meth)acrylic polymer, and nanoindentation hardness of the pressure-sensitive adhesive/adhesive layer is 0.1 MPa or more and 1.0 MPa or less.
    Type: Application
    Filed: September 12, 2022
    Publication date: December 12, 2024
    Inventors: Akiko SUGINO, Tomokazu TAKAHASHI, Daisuke HATTORI, Chie HAMADA, Toshiya YOSHIMI
  • Publication number: 20240002707
    Abstract: A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5<B/A<900.
    Type: Application
    Filed: November 18, 2021
    Publication date: January 4, 2024
    Inventors: Akiko TANAKA, Yuto SUZUKI, Chie HAMADA
  • Publication number: 20230115205
    Abstract: An optical-fiber-embedding sheet which is a strip-shaped sheet material containing an optical fiber to be used as a sensor and is configured of a base material and an adhesive layer formed thereover which is to be bonded to a placement object where the optical fiber is to be placed, the optical fiber having been embedded in the adhesive layer. The optical fiber is placed by applying a primer, which is for curing the adhesive layer by a chemical reaction with the adhesive layer, to a placement object for the optical fiber and thereafter applying the optical-fiber-embedding sheet to the portion of the placement object to which the primer has been applied.
    Type: Application
    Filed: March 19, 2021
    Publication date: April 13, 2023
    Inventors: Naoki SOGABE, Michio IMAI, Yohei TAIRA, Akiko TANAKA, Takehiko MISHIMA, Chie HAMADA