Patents by Inventor Chie SUGAMA

Chie SUGAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10566304
    Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: February 18, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
  • Publication number: 20190355690
    Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
    Type: Application
    Filed: January 11, 2017
    Publication date: November 21, 2019
    Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Patent number: 10363608
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles having a volume-average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: July 30, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuki Kawana, Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Chie Sugama, Dai Ishikawa
  • Publication number: 20180342478
    Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
    Type: Application
    Filed: September 7, 2016
    Publication date: November 29, 2018
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Publication number: 20180250751
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles having a volume-average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 6, 2018
    Inventors: Yuki KAWANA, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Hideo NAKAKO, Chie SUGAMA, Dai ISHIKAWA