Abstract: A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

Abstract: Disclosed is an epoxy resin composition for optical semiconductor encapsulation which contains an epoxy resin obtained by co-hydrolysis/condensation of alkoxy silicon compounds expressed as XSi(R1)n(OR2)3-n (wherein X represents an organic group having an epoxy group; R1 represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted aryl group or a substituted or unsubstituted alkenyl group having 2-5 carbon atoms; R2 represents an alkyl group having 1-4 carbon atoms; n represents an integer of 0-2; and when more than one R1 are included, they may be the same as or different from each other) or co-hydrolysis/condensation of such an alkoxy silicon compound and another specific alkoxy silicon compound.

Abstract: The present invention relates to a resin composition for protective films which comprises an epoxy resin having two or more epoxy groups, a curing agent, a curing accelerator, a solvent, and a colloidal slurry of fine silica particles having an average particle diameter, as determined by conversion from the specific surface area, of 50 nm or smaller, a pH of 6 to 8, and an alkali metal content of 5 ppm or lower. The resin composition gives a protective film which satisfies adhesiveness and visible-light transmission, which are performances conventionally required. The protective film further has high surface smoothness even when the substrate surface is not smoothed. The resin composition has satisfactory storage stability and does not stain liquid crystal. Furthermore, a cured film obtained from the resin composition has excellent high-temperature resistance, especially ITO resistance.

Abstract: The present invention relates to an epoxy resin composition for sealing photosemiconductor, the epoxy resin composition containing (A) a bisphenol-type epoxy resin represented by the following formula (1) (in the formula, R1s represent hydrogen atom, a C1-C8 alkyl group, a halogen atom; R2s represent hydrogen atom, a C1-C5 alkyl group, a halogen-substituted (C1-C5) alkyl group or phenyl group; n represents an integer), where the ratio of the total content of such bisphenol-type lower molecular epoxy resins with n=0, 1 or 2 is 10% by weight or more of the whole resin; (B) a terpene backbone-containing polyvalent phenol curing agent prepared by adding two molecules of phenols to one molecule of a cyclic terpene compound; (C) a curing-promoting agent; (D) at least one resin selected from the group consisting of epoxy resins except for the component (A) and novolak resins as a curing agent; and an photosemiconductor device sealed with the cured material of the composition, where the composition has great wor

Abstract: A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

Abstract: The object of the present invention is to provide a composition for protective films excellent in adhesion and visible light transmittance that can form a protective film having high surface smoothness even on a substrate whose surface has not been smoothed and has extremely high resistance to thermal yellowing without staining liquid crystals. Especially, when used for protective films of color filters for liquid-crystal displays, the protective films have the excellent high-temperature resistance under ITO (yellowing resistance) vapor deposition.

Abstract: The present invention relates to a marking composition capable of developing a vivid white color upon the application of laser beams, which composition comprises a polyolefin resin having no fluidity at a temperature of 50.degree. C. and at least one inorganic material selected from talc, calcium carbonate and aluminum hydroxide, wherein the inorganic material is blended in a ratio of 1-300 w/w % based upon the polyolefin resin. The invention also provides the resin moldings obtained by molding the marking compositions.