Abstract: A fault-tolerant unit and a fault-tolerant method for through-silicon via (TSV) are provided. The fault-tolerant unit includes TSV structures TSV1˜TSVn, nodes N11˜N1n, nodes N21˜N2n and a switching module. The TSV structure TSVi is connected between the node N1i of the first chip and the node N2i of the second chip, wherein 1?i?n. The switching module is connected between the nodes N21˜N2n of the second chip and a test path of the second chip. In normal operation state, the switching module disconnects the test path and the nodes N21˜N2n when the TSV structures TSV1˜TSVn are valid. The switching module connects the node N2i to at least another one of the nodes N21˜N2n when the TSV structure TSVi is faulty in the normal operation state. In test status, the switching module connects the test path to the nodes N21˜N2n.

Abstract: A touch display driving circuit capable of responding to CPU commands, including: a first interface for receiving pixel data and touch configuration data; a second interface for coupling with a touch display; and a control unit, which drives the touch display via the second interface to show an image according to the pixel data, and executes a touch detection procedure on the touch display via the second interface, wherein the touch detection procedure is determined according to the touch configuration data.

Abstract: A touch module and a manufacturing method thereof are disclosed. The touch module includes a substrate, at least two first touch electrodes, at least two second touch electrodes, at least one electrode channel, and at least one bridge. All of the first touch electrodes, the second touch electrodes, and the electrode channel are embedded in the substrate. The electrode channel is configured to connect the second touch electrodes to each other. The bridge crosses over the electrode channel, is configured to electrically connect the first touch electrodes to each other. The first touch electrodes and the second touch electrodes are insulated from each other.

Abstract: An electrical connector structure includes a housing and signal modules mounted therein. Each signal module includes an insulating body, conductive terminals and a ground shield. The insulating body has a first side having a guide projection, and a second side opposite to the first side and having a guide groove. When a first signal module has been mounted in the housing, a second signal module is guided and moved to mount into the housing by the guide groove of the second signal module receiving the guide projection of the first signal module, or by the guide projection of the second signal module sliding into the guide groove of the first signal module, whereby reducing relative movement between signal modules in the housing. The signal modules may be mounted one by one in the housing, or may be stacked side by side and then mounted in the housing as a whole.

Abstract: A touch display device having auxiliary capacitor, including: at least one touch operation area, each having two opposing substrates, between which are a first electrode, a first conductive line coupled with the first electrode, a second electrode, a second conductive line coupled with the second electrode, and a display layer neighboring both the first electrode and the second electrode; a display driver unit for outputting at least one display driving voltage; a touch detection unit having at least one touch signal sensing port; at least one auxiliary capacitor, each coupled with one of the at least one touch operation area; and at least one switch element; wherein, each of the at least one display driving voltage is coupled to one of the at least one touch operation area via one of the at least one switch element.

Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.

Abstract: A scan driving circuit of a display apparatus is electrically connected to the display panel through a plurality of scan lines and includes a plurality of stages of driving unit. The driving unit comprises a shift control device outputting a control signal according to a starting signal and a driving device. The driving device outputs an output signal to the corresponding scan line according to the control signal, a first trigger signal and a second trigger signal. The output signal is used as the starting signal of the next stage of driving unit, and the rising transition time of the second trigger signal and the falling transition time of the first trigger signal have an overlap.

Abstract: In one embodiment, a method comprising causing motion of an enclosed container comprising substrate material and graphite material within the container; and coating surfaces of the substrate material with the graphite material responsive to the motion of the container, the coated surfaces comprising graphene or graphene layers.

Abstract: A projector and a light source module including a light emitting diode element, a pin connector, and two power cords are provided. The light emitting diode element has a first electrode and a second electrode. The pin connector is disposed on the light emitting diode element and has two connection pins, wherein each connection pin has a first connection end and a second connection end, and the two first connection ends respectively contact the first electrode and the second electrode. The two power cords are respectively connected to the first electrode and the second electrode through the two connection pins, wherein each power cord includes a joint and a wire connected to each other, each joint and the corresponding second connection end are mutually plugged along a first axial direction, each wire extends out from the corresponding joint along a second axial direction perpendicular to the first axial direction.

Abstract: The present invention provides an Advanced Domain Name System for implementing method of data transfer between TCP (Transmission Control Protocol) and UDP (User Datagram Protocol) in transport layer for IP protocols in application layer of the Communications Protocol, and also provides a relay server between a PC and a server for transmitting data.

Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.

Abstract: The present invention relates to a display device, comprising: a display unit comprising a pixel layer; a backlight unit; and a modulation unit disposed between the display unit and the backlight unit, wherein the modulation unit comprises a plurality of conductive layers and a liquid crystal layer disposed between the plurality of conductive layers, and the liquid crystal layer comprises a polymer dispersed liquid crystal (PDLC) or a polymer stabilized liquid crystal (PSLC).

Abstract: The present disclosure provides a semiconductor structure includes a substrate and an epitaxy region that is partially disposed in the substrate. A doping concentration of the epitaxy region increases from a bottom portion to a top portion of the epitaxy region. The present disclosure also provides a method for manufacturing the semiconductor structure, including forming a recess in a substrate; forming an epitaxy region in the recess; and in situ doping the epitaxy region to form a doping concentration profile increasing from a bottom portion to a top portion of the epitaxy region.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes proving a substrate. The substrate includes a gate stack over the substrate and source/drain regions separated by the gate stack. A first dislocation with a first pinch-point is formed within the source/drain region with a first depth. A second dislocation with a second pinch-point is formed within the source/drain region at a second depth. The second depth is substantial smaller than the first depth.

Abstract: A semiconductor device includes a gate structure located on a substrate and a raised source/drain region adjacent to the gate structure. The raised source/drain region includes: a first epitaxial-grown doped layer of the raised source/drain region in contact with the substrate; a second epitaxial-grown doped layer on the first epitaxial-grown doped layer and including a same dopant species as the first epitaxial-grown doped layer, wherein the second epitaxial-grown doped layer includes a higher dopant concentration than the first epitaxial-grown doped layer and interfacing the gate structure by using a predetermined distance; and a third epitaxial-grown doped layer on the second epitaxial-grown doped layer and including the same dopant species as the first epitaxial-grown doped layer, wherein the third epitaxial-grown doped layer includes a higher dopant concentration than the second epitaxial-grown doped layer.

Abstract: A system for dialing from Internet extension of other SIP proxy server to conventional extension is disclosed. A VoIP gateway or an IP auto attendant is used for dialing from Internet extension to conventional extension. The phone number of the Private Branch Exchange and the voice guidance are not needed. The calling number of SIP message is interpreted directly and converted into DTMF (Dual-tone multi-frequency) messages for dialing into a conventional extension.

Abstract: A light source module includes a lighting member and an optical member. The optical member is transparent and is made of a light curable material or a thermosetting material. The optical member covers the lighting member. The optical member has a first optical layer and a second optical attached to the first optical layer. A refractive index of the first optical layer is greater than 1, and a refractive index of the second optical layer is greater than 1 and is not identical to the refractive index of the first optical layer.

Abstract: A semiconductor structure including a semiconductor substrate is provided. The semiconductor substrate includes a surface. A gate structure is provided on the surface. An interface lower than the surface is provided. An epitaxial regrowth region adjacent the gate structure is disposed on the interface. In addition, the epitaxial regrowth region extends over the surface and includes a bottom layer and a cap layer. The activation of the cap layer is lower than that of the bottom layer. Moreover, the bottom layer is lower than the surface and the gate structure. Furthermore, the bottom layer includes a first downwardly-curved edge and a second downwardly-curved edge over the first one. The first downwardly-curved edge is connected with the second downwardly-curved edge at two endpoints. The two endpoints are in contact with the surface of the semiconductor substrate.

Abstract: An optical lens assembly includes a sensor array, a lens array, and a shading element. The sensor array has a plurality of sensors arranged as a matrix to convert optical signals into electrical signals. The lens array has a plurality of lens units arranged as a matrix. The lens array is provided on the sensor array, and the lens units are aligned with the sensors to focus light onto the sensors respectively. The lens units are made of a light curable material or a thermosetting material, and separated from each other to form a trench between each two of the neighboring lens units. The shading element is received in the trenches of the lens array to avoid light which goes into any one of the lens units from entering into the other lens units.