Patents by Inventor Chieh-An YEH

Chieh-An YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240109768
    Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO
  • Stacked structure and method for manufacturing the same
    Patent number: 11332363
    Abstract: A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 ?m to about 150 ?m, and a burr length on a surface of the metal layer is about 0.8 ?m to about 7 ?m.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: May 17, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chieh-An Yeh, Tai-Hung Kuo
  • SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210246015
    Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 12, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO
  • STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210130166
    Abstract: A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 ?m to about 150 ?m, and a burr length on a surface of the metal layer is about 0.8 ?m to about 7 ?m.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO