Patents by Inventor Chieh Chien Chen

Chieh Chien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250001121
    Abstract: A liquid reservoir includes a liquid storage chamber, a nebulizing module, a detection module, a lid, and a bubble blocking structure. The liquid storage chamber has an opening, and a bottom of the liquid storage chamber has a through hole. The nebulizing module is disposed in the through hole. The detection module is disposed within the liquid storage chamber and adjacent to the through hole. The lid is disposed on the liquid storage chamber and covers the opening. The bubble blocking structure is disposed in the liquid storage chamber, and an orthogonal projection of the bubble blocking structure that is projected to the bottom of the liquid storage chamber at least partially overlaps with the through hole.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 2, 2025
    Inventors: Chieh-Sheng Cheng, CHUN-CHIA JUAN, CHIA-CHIEN CHANG, YEN-TING CHEN
  • Patent number: 11751339
    Abstract: An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: September 5, 2023
    Assignee: GLOBAL MASTER TECH. CO., LTD.
    Inventors: Yao-Hua Kao, Chieh-Chien Chen
  • Publication number: 20220377909
    Abstract: An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 24, 2022
    Applicant: GLOBAL MASTER TECH. CO., LTD.
    Inventors: Yao-Hua KAO, Chieh-Chien CHEN
  • Patent number: D464057
    Type: Grant
    Filed: December 29, 2001
    Date of Patent: October 8, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chieh Chien Chen, Yin Sheng Yeh, Fu-Ming Chen