Abstract: The present invention provides an electrolyte material formulation including: (a) a monomer of formula (I) (b) a monomer of formula (II) ?and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). The present invention further provides an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: An electrolyte material formulation including: (a) a monomer of formula (I) (b) a monomer of formula (II) ?and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). Also, an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.

Abstract: The present invention provides an electrolyte material formulation including: (a) a monomer of formula (I) (b) a monomer of formula (II) and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). The present invention further provides an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.

Abstract: An electrolytic material formulation is provided, which comprises: (a1) a conductive compound, (b1) an oxidant and (c1) a polymerizable component. An electrolytic material composition obtained from the electrolytic material formulation through polymerization is also provided. The electrolytic material composition is applicable to a solid capacitor. Compared to a conventional liquid electrolytic capacitor, the solid electrolyte capacitor according to the present invention has advantages of long life, high voltage resistance, high capacitance, and no occurrence of capacitor rupture, and is especially applicable to electronic products that require high temperature resistance and high frequency resistance.

Abstract: The electrolytic capacitor has an insulating casing, at least one capacitor element and multiple external terminals. The casing has multiple through holes and mounting protrusions. The at least one capacitor element is mounted in the casing and has multiple inner conductive pins connecting to a coil. Each external terminal is attached to a bottom panel of the insulating casing, connects to a corresponding inner conductive pin and has a main body, a connecting portion and two fixing portions. The connecting portion is formed on and extends from a side of the main body and has a conducting hole attached to a corresponding conductive pin. The fixing portions respectively extend from two ends of the main body and engage with the mounting protrusions. Each external terminal provides a soldering surface being flat and having large soldering area, therefore the electrolytic capacitor can be firmly soldered on a circuit board.

Abstract: The electrolytic capacitor has an insulating casing, at least one capacitor element and multiple external terminals. The casing has multiple through holes and mounting protrusions. The at least one capacitor element is mounted in the casing and has multiple inner conductive pins connecting to a coil. Each external terminal is attached to a bottom panel of the insulating casing, connects to a corresponding inner conductive pin and has a main body, a connecting portion and two fixing portions. The connecting portion is formed on and extends from a side of the main body and has a conducting hole attached to a corresponding conductive pin. The fixing portions respectively extend from two ends of the main body and engage with the mounting protrusions. Each external terminal provides a soldering surface being flat and having large soldering area, therefore the electrolytic capacitor can be firmly soldered on a circuit board.

Abstract: An electrolytic capacitor has at least one capacitor element and an insulating housing. Each capacitor element has a body and at least two leads. The leads connect to the body. The insulating housing has a base. The base has a top with at least one opening, a bottom, at least two holes and at least one chamber. The opening is sealed after the at least one capacitor element is mounted in the base. The holes are defined through the bottom and allow the leads to extend out and to be fastened with sealant. The chamber is formed in the base, communicates with the opening and the holes and receives the capacitor element. Because the electrolytic capacitor is simple, the electrolytic capacitor is assembled easily and quickly to lower cost. Further, the insulating housing is able to hold multiple capacitor elements, so the solid electrolytic capacitor has an increased capacitance.

Abstract: An electrolytic capacitor has at least one capacitor element and an insulating housing. Each capacitor element has a body and at least two leads. The leads connect to the body. The insulating housing has a base. The base has a top with at least one opening, a bottom, at least two holes and at least one chamber. The opening is sealed after the at least one capacitor element is mounted in the base. The holes are defined through the bottom and allow the leads to extend out and to be fastened with sealant. The chamber is formed in the base, communicates with the opening and the holes and receives the capacitor element. Because the electrolytic capacitor is simple, the electrolytic capacitor is assembled easily and quickly to lower cost. Further, the insulating housing is able to hold multiple capacitor elements, so the solid electrolytic capacitor has an increased capacitance.

Abstract: The present invention relates to a structure of chip type electrolytic capacitor, which comprises a casing cover and a partition to separate space of casing cover into a dielectric chamber and a buffer chamber, a dielectric which includes lead pins, holes on the partition for the lead pins pass through. The dielectric is installed in the dielectric chamber, and lead pins pass through the holes on partition and extend to the buffer chamber. The buffer chamber is sealed with a bottom cover which also includes holes for lead pins. A stuff of epoxide is filled into the buffer chamber to fix the dielectric and its lead pins. A top cover is to seal the dielectric chamber for filling electrolyte. The casing cover is made with high strength engineering plastic by plastic injection machine. A supersonic welding and the epoxide adhesive solidification package technologies replace rubber packing.

Abstract: A chip type capacitor having a casing cover, a dielectric, an elastomer, and a cover plate. The casing cover is formed as the outer casing of a capacitor. An open receiving chamber is provided in the casing cover. A plurality of lines capable of being broken are formed at a bottom of the casing cover. The dielectric is received in the receiving chamber of the casing cover. The dielectric has two lead pins. The elastomer has two first through holes. The lead pins pass through the first through holes of the elastomer so that the elastomer covers the dielectric. The cover plate has two second through holes. The lead pins of the dielectric pass through the second through hole of the cover plate so that the cover plate covers the elastomer. An outer diameter of the elastomer is slightly larger than the inner diameter of an inner wall of the receiving chamber. The elastomer is compressed by a fixture and then the elastomer is placed in the receiving chamber for enhancing the sealing of the capacitor.

Abstract: A surface mounted capacitor comprises a casing, an inner board, a dielectric medium, aid an outer board. The inner board and the dielectric medium are mounted in the casing with two leads of the dielectric medium extended out of the casing. Resin glue and electrolyte are filled into a compartment defined in the casing and the outer board is mounted to seal an opening of the casing. The leads are bent and then positioned in grooves defined in the casing.