Patents by Inventor Chieh-Han LEE

Chieh-Han LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR POLISHING WAFER
    Publication number: 20190247974
    Abstract: A method for performing a chemical mechanical polishing (CMP) is disclosed. The method includes supplying a slurry onto a polishing pad, holding a first wafer against the polishing pad by a first polishing head, holding a second wafer against the polishing pad by a second polishing head, and rotating the polishing pad.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Yi TSAI, Wen-Pin HO, Chieh-Han LEE, Yu-Hsiang CHAO
  • Chemical mechanical polishing system
    Patent number: 10265829
    Abstract: A chemical mechanical polishing system includes a platen, a slurry introduction device and at least one polishing head. The platen is configured to allow a polishing pad to be disposed thereon. The slurry introduction device is configured to supply slurry onto the polishing pad. The polishing head includes a main body and at least one grinding piece. The main body has an accommodation space for accommodating a wafer. The grinding piece is disposed on the main body. The grinding piece has a grinding surface configured to grind against the polishing pad.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Yi Tsai, Wen-Pin Ho, Chieh-Han Lee, Yu-Hsiang Chao
  • CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD FOR POLISHING WAFER
    Publication number: 20170120414
    Abstract: A chemical mechanical polishing system includes a platen, a slurry introduction device and at least one polishing head. The platen is configured to allow a polishing pad to be disposed thereon. The slurry introduction device is configured to supply slurry onto the polishing pad. The polishing head includes a main body and at least one grinding piece. The main body has an accommodation space for accommodating a wafer. The grinding piece is disposed on the main body. The grinding piece has a grinding surface configured to grind against the polishing pad.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 4, 2017
    Inventors: Yu-Yi TSAI, Wen-Pin HO, Chieh-Han LEE, Yu-Hsiang CHAO