Patents by Inventor Chieh-Hsin HSIEH

Chieh-Hsin HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230102166
    Abstract: A method of manufacturing a semiconductor device includes forming a protective layer over a substrate. The hydrophilicity of the protective layer is reduced. A resist layer is formed over the protective layer, and the resist layer is patterned.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 30, 2023
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20230063073
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer including an organic material over a substrate. A second layer including a reaction product of a silicon-containing material and a photoacid generator is formed over the first layer. A photosensitive layer is formed over the second layer, and the second layer is patterned.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20230036859
    Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.
    Type: Application
    Filed: July 16, 2021
    Publication date: February 2, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG