Patents by Inventor Chieh-Ju Wu

Chieh-Ju Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustment mechanism of mold system having electrically adjusting and positioning functions
    Patent number: 9233496
    Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivotally-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: January 12, 2016
    Assignee: National Kaohsiung University of Applied Sciences
    Inventors: Cheng-Hsien Wu, Cheng-Hao Chiu, Chieh-Ju Wu, Kai-En Chang
  • Adjustment Mechanism of Mold System Having Electrically Adjusting and Positioning Functions
    Publication number: 20120273983
    Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivot-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 1, 2012
    Inventors: Cheng-Hsien Wu, Cheng-Hao Chiu, Chieh-Ju Wu, Kai-En Chang