Abstract: A power-adjusting method for uplink transmission is provided. The power-adjusting method is applied to user equipment (UE). In response to the UE transmitting a first packet carrying a specific message to a network node, the power-adjusting method includes the UE increasing the transmission power to transmit the first packet.

Abstract: An electronic device with switchable modes includes a light scattering switching element, a light absorbing switching and an image generating element. The light absorbing switching element is disposed adjacent to the light scattering switching element. The image generating element is provided for generating an image. In a projection mode, the image generated by the image generating element sequentially passes through the light scattering switching element and the light absorbing switching element to be displayed.

Abstract: An electronic device comprises: a first panel comprising: a first display layer having a first side and a second side opposite thereto, wherein the first display layer receives an incident light and reflects a first reflected light, a light in the incident light other than the first reflected light is a first transmitting light, the first side is a light emitting side of the first reflected light, and the second side is a transmitting side of the first transmitting light; a first photoelectric conversion unit disposed adjacent to the second side, wherein the first photoelectric conversion unit absorbs the first transmitting light and converts it into electrical energy; and a second panel disposed opposite to the first panel, wherein the second panel comprises a second display layer, and the first photoelectric conversion unit is disposed between the first display layer and the second display layer.

Abstract: An electronic device includes pixel regions and pixel spacing regions, and includes: a display layer disposed in the pixel regions and the pixel spacing regions, and including a liquid crystal material and a dye material; and reflective layers respectively disposed in the pixel regions, and at one side of the display layer. The display layer is in a scattering state under a non-display state, and light is scattered by the liquid crystal material and absorbed by the dye material when the light passes through the display layer. The display layer in the pixel regions is in a transmissive state and the display layer in the pixel spacing regions is in a scattering state under a display state, and light passes through the liquid crystal material and the dye material in the pixel regions and is reflected by the reflective layers when the light passes through the display layer.

Abstract: An electronic device includes a dimming structure, a first anti-reflection film and a second anti-reflection film. The dimming structure includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The dimming structure includes a first conductive layer disposed between the first substrate and the liquid crystal layer, and a second conductive layer disposed between the second substrate and the liquid crystal layer. The dimming structure is disposed between the first anti-reflection film and the second anti-reflection film, and each of the first anti-reflection film and the second anti-reflection film has a reflectivity of smaller than 2%.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a semiconductor substrate, a trench, and a word line structure in the trench. The semiconductor substrate has a first active region and an isolation layer. The first active region includes a first sub-active region, a second sub-active region, and a first separation channel separating the first sub-active region from the second sub-active region. The word line structure is adjacent to the first active region and includes a word line insulating layer covering inner side surfaces of the trench, a word line electrode on the word line insulating layer, and a word line capping structure on the word line electrode. A depth of the first separation channel is substantially identical to a thickness of the isolation layer.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a semiconductor substrate, a trench, and a word line structure in the trench. The semiconductor substrate has a first active region and an isolation layer. The first active region includes a first sub-active region, a second sub-active region, and a first separation channel separating the first sub-active region from the second sub-active region. The word line structure is adjacent to the first active region and includes a word line insulating layer covering inner side surfaces of the trench, a word line electrode on the word line insulating layer, and a word line capping structure on the word line electrode. A depth of the first separation channel is substantially identical to a thickness of the isolation layer.

Abstract: An electronic device is provided. The electronic device includes a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a plurality of first electrodes disposed between the first substrate and the liquid crystal layer; a plurality of second electrodes disposed between the second substrate and the liquid crystal layer; a first signal line disposed between the first substrate and the liquid crystal layer, and electrically connected to one of the plurality of first electrodes; and a second signal line disposed between the second substrate and the liquid crystal layer, and electrically connected to one of the plurality of second electrodes. The first signal line and the second signal line include a blackened metal.

Abstract: An electronic device includes a scattering structure, a dimming structure and a controller. The dimming structure is arranged on the scattering structure. The controller is electrically connected to the dimming structure. The controller includes a first control unit, and the first control unit is provided to adjust the transmittance of the dimming structure.

Abstract: An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.

Abstract: An electronic device is provided. The electronic device includes a first panel. The first panel includes a first substrate, a second substrate, a liquid crystal layer, a first transparent electrode, a second transparent electrode, and a first signal line. The second substrate is opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The first transparent electrode is disposed between the first substrate and the liquid crystal layer. The second transparent electrode is disposed between the second substrate and the liquid crystal layer. The first signal line is electrically connected to the first transparent electrode and extending along a first direction. The impedance of the first signal line is less than the impedance of the first transparent electrode.

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

Abstract: An electronic device includes: a light modulation medium layer including a liquid crystal material and a dye material; a reflective element disposed opposite to the light modulation medium layer and away from a display side of the electronic device; a reflective polarizing element disposed between the light modulation medium layer and the reflective element; and a polarizer disposed between the reflective polarizing element and the reflective element, wherein the reflective element has a reflectance of light with wavelengths ranging from 380 nm to 780 nm greater than or equal to 80%.