Abstract: A stacked capacitor assembly and a stacked capacitor packaging structure. The stacked capacitor packaging structure includes a stacked capacitor assembly, an electrode assembly and an insulating package body. The stacked capacitor assembly includes a plurality of conductive substrates. The insulating package body can cover the stacked capacitor assembly and carry the electrode assembly. The conductive substrates can conform to the following formula: H=nt+(n?1) d, in which H is a total thickness of the conductive substrates, n is the number of the conductive substrates, t is a thickness of each conductive substrate, and d is a distance between two adjacent conductive substrates. The number of the conductive substrates is between 2 and 30, the thickness of each conductive substrate is between 80 ?m and 150 ?m, the distance between the two adjacent conductive substrates is between 0.05 ?m and 30 ?m, and the ratio d/H is between 0.35 and 350.

Abstract: A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.

Abstract: A conductive paste, a manufacturing method of a conductive paste, a capacitor element and a manufacturing method of a capacitor element are provided. The conductive paste includes a conductive composite material powder and a resin. The conductive composite material powder is obtained by grinding a conductive composite material in a solid state. The resin is mixed with the conductive composite material powder.

Abstract: A capacitor element structure, a capacitor assembly packaging structure and an electronic device. The capacitor assembly packaging structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor element structures stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate the capacitor element structures. The electrode assembly includes a first electrode structure and a second electrode structure that are configured to cooperate with the insulating package body and electrically connected to the capacitor element structure. Each of the capacitor element structures includes an oxide layer, the oxide layer has a plurality of micro recessed spaces that are irregularly concaved and arranged, and each of the micro recessed spaces is partially filled with an electrolyte substance.

Abstract: A wound capacitor packaging structure and a sealing element thereof. The wound capacitor packaging structure includes a wound assembly, a conductive assembly, a package casing and a sealing element. The sealing element is disposed inside the package casing for cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward to press the sealing element, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion. The sealing element includes an elastomeric seal structure pressed by the surrounding concave position-limiting portion, and an oleophobic and high-temperature-resistant structure for protecting the elastomeric seal structure.

Abstract: An environment synthesis framework generates virtual environments from a synthesized two-dimensional (2D) satellite map of a geographic area, a three-dimensional (3D) voxel environment, and a voxel-based neural rendering framework. In an example implementation, the synthesized 2D satellite map is generated by a map synthesis generative adversarial network (GAN) which is trained using sample city datasets. The multi-stage framework lifts the 2D map into a set of 3D octrees, generates an octree-based 3D voxel environment, and then converts it into a texturized 3D virtual environment using a neural rendering GAN and a set of pseudo ground truth images. The resulting 3D virtual environment is texturized, lifelike, editable, traversable in virtual reality (VR) and augmented reality (AR) experiences, and very large in scale.

Abstract: A method includes depositing a gate dielectric layer on a first channel region; depositing a p-type work function tuning layer on the gate dielectric layer; exposing the p-type work function tuning layer to a silicon-based precursor for a duration of time; and depositing a n-type work function tuning layer on the p-type work function tuning layer. Exposing the p-type work function tuning layer to the silicon-based precursor can form a silicon-containing layer on the p-type work function tuning layer.

Abstract: An environment synthesis framework generates virtual environments from a synthesized two-dimensional (2D) satellite map of a geographic area, a three-dimensional (3D) voxel environment, and a voxel-based neural rendering framework. In an example implementation, the synthesized 2D satellite map is generated by a map synthesis generative adversarial network (GAN) which is trained using sample city datasets. The multi-stage framework lifts the 2D map into a set of 3D octrees, generates an octree-based 3D voxel environment, and then converts it into a texturized 3D virtual environment using a neural rendering GAN and a set of pseudo ground truth images. The resulting 3D virtual environment is texturized, lifelike, editable, traversable in virtual reality (VR) and augmented reality (AR) experiences, and very large in scale.

Abstract: A method includes depositing a gate dielectric layer on a first channel region; depositing a p-type work function tuning layer on the gate dielectric layer; exposing the p-type work function tuning layer to a silicon-based precursor for a duration of time; and depositing a n-type work function tuning layer on the p-type work function tuning layer. Exposing the p-type work function tuning layer to the silicon-based precursor can form a silicon-containing layer on the p-type work function tuning layer.

Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

Abstract: A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 ?m, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.

Abstract: A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.

Abstract: A stacked capacitor assembly and a method of manufacturing the same, and a stacked capacitor package structure are provided. The stacked capacitor assembly includes a plurality of conductive substrates, an inner conductive structure and an outermost covering structure. Each of the conductive substrates has a first portion and a second portion opposite to the first portion. The inner conductive structure is configured to cover the first portion of each of the conductive substrates and be disposed between any two adjacent ones of the conductive substrates. The outermost covering structure is configured to cover the inner conductive structure. The inner conductive structure is provided without carbon-containing materials or silver-containing materials, and a space is formed between any two adjacent ones of the conductive substrates without carbon-containing materials or silver-containing materials.

Abstract: A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.

Abstract: A method for manufacturing a semi-solid electrolytic capacitor includes: providing a capacitor element; impregnating the capacitor element with a dispersant; baking the capacitor element impregnated with the dispersant; impregnating the baked capacitor element with an electrolyte; and packaging the capacitor element impregnated with the electrolyte. The dispersant is a conductive polymer formed from at least one of polythiophene having at least one sulfonic acid group and polyselenophene having at least one sulfonic acid group.

Abstract: A conductive paste, a manufacturing method of a conductive paste, a capacitor element and a manufacturing method of a capacitor element are provided. The conductive paste includes a conductive composite material powder and a resin. The conductive composite material powder is obtained by grinding a conductive composite material in a solid state. The resin is mixed with the conductive composite material powder.

Abstract: An environment synthesis framework generates virtual environments from a synthesized two-dimensional (2D) satellite map of a geographic area, a three-dimensional (3D) voxel environment, and a voxel-based neural rendering framework. In an example implementation, the synthesized 2D satellite map is generated by a map synthesis generative adversarial network (GAN) which is trained using sample city datasets. The multi-stage framework lifts the 2D map into a set of 3D octrees, generates an octree-based 3D voxel environment, and then converts it into a texturized 3D virtual environment using a neural rendering GAN and a set of pseudo ground truth images. The resulting 3D virtual environment is texturized, lifelike, editable, traversable in virtual reality (VR) and augmented reality (AR) experiences, and very large in scale.

Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

Abstract: A method of manufacturing a capacitor assembly package structure includes providing a capacitor unit and a conductive connection layer, in which the capacitor unit includes a plurality of capacitors, and each of the capacitors includes a positive portion and a negative portion electrically connected to the conductive connection layer; partially enclosing the capacitors by an insulative package body, in which the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body; and then enclosing a first portion of the insulative package body and electrically connecting to the positive portion of each of the capacitors by a first electrode structure, and enclosing a second portion of the insulative package body and electrically connecting to the conductive connection layer by a second electrode structure.

Abstract: A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.