Abstract: A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to expose the cover metal layer. The present invention can form the cover metal layer to cover the bond pad layer and then forms the solder mask. Thereafter, the hole is made to the solder mask at the position of the cover metal layer to expose thereof. Because the bond pad layer is embedded in a dielectric layer of the multi-layer substrate, adhesion intensity between the bond pad layer and the dielectric layer can be enhanced. Meanwhile, contact of the bond pad layer with the solder can be prevented with the cover metal layer.

Abstract: The present invention provides a protective material, which includes an acidic material and an absorbent additive. An alkaline electrolyte will be neutralized by the acidic material, and water produced from the neutralization reaction of the acidic material and the alkaline electrolyte will be absorbed by the absorbent additive. In addition, the present invention also discloses an energy storage module using the same.

Abstract: A structure of energy storage device, including a plurality of rechargeable batteries disposed in a row with a distance to each other, and a heat dissipating structure firmly inserted accordingly between the rechargeable batteries. The heat dissipating structure is a heat dissipating medium of the energy storage device.

Abstract: A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to expose the cover metal layer. The present invention can form the cover metal layer to cover the bond pad layer and then forms the solder mask. Thereafter, the hole is made to the solder mask at the position of the cover metal layer to expose thereof. Because the bond pad layer is embedded in a dielectric layer of the multi-layer substrate, adhesion intensity between the bond pad layer and the dielectric layer can be enhanced. Meanwhile, contact of the bond pad layer with the solder can be prevented with the cover metal layer.