Patents by Inventor Chieh-Lin Kuo

Chieh-Lin Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compound of silver nanowire with polymer and compound of metal nanostructure with polymer
    Patent number: 8029700
    Abstract: The invention provides a compound of silver nanowire with polymer. The compound comprises a resin, a dispersant, and a plurality of silver nanowires. The dispersant is capable of copolymerizing with the resin. The dispersant has a plurality of functional groups capable of connecting with the silver nanowires respectively. Therefore, the silver nanowires could disperse in the resin by means of the functional groups of the dispersant.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: October 4, 2011
    Assignee: Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National Defense
    Inventors: Ming-Hsiung Wei, Kuo-Chu Hwang, Chieh-Lin Kuo, Kai-Yia Chang
  • COMPOUND OF SILVER NANOWIRE WITH POLYMER AND COMPOUND OF METAL NANOSTRUCTURE WITH POLYMER
    Publication number: 20100276648
    Abstract: The invention provides a compound of silver nanowire with polymer. The compound comprises a resin, a dispersant, and a plurality of silver nanowires. The dispersant is capable of copolymerizing with the resin. The dispersant has a plurality of functional groups capable of connecting with the silver nanowires respectively. Therefore, the silver nanowires could disperse in the resin by means of the functional groups of the dispersant.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Inventors: MING-HSIUNG WEI, Kuo-Chu Hwang, Chieh-Lin Kuo, Kai-Yia Chang