Abstract: A venting device includes a first flap, which is configured to be actuated to swing upward during a rising time, and a second flap, which is disposed opposite to the first flap and configured to be actuated to swing downward during a falling time, a first actuating portion disposed on the first flap, and a second actuating portion disposed on the second flap. The venting device configured to form a vent is disposed within a wearable sound device or to be disposed within the wearable sound device. The vent is formed via applying a first voltage to the first actuating portion and applying a second voltage on the second actuating portion, such that the venting device gradually forms the vent.

Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.

Abstract: A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: An auxiliary prediction system is provided to predict reliability of an object after a specific operation is applied to the target object. The auxiliary prediction system includes an image correction module and an analysis module. The image correction module performs an image correction procedure to convert an original image of the target object into a first correction image. The analysis module performs a feature analysis on the first correction image through an artificial intelligence model that has been trained, so as to predict whether the target object has a defect or not after the specific operation.

Abstract: The subject matter described herein includes methods, systems, and computer readable media for mask embedding for realistic high-resolution image synthesis. According to one method for mask embedding for realistic high-resolution image synthesis includes receiving, as input, a mask embedding vector and a latent features vector, wherein the mask embedding vector acts as a semantic constraint; generating, using a trained image synthesis algorithm and the input, a realistic image, wherein the realistic image is constrained by the mask embedding vector; and outputting, by the trained image synthesis algorithm, the realistic image to a display or a storage device.

Abstract: A keyswitch includes a board, a cap opposite to the board, a first support device, a second support device, and a first link member. The first support device is disposed between the cap and the board. An end of the first support device is connected to the board. Another end of the first support device is connected to the cap. The second support device is disposed between the cap and the board and is separate from the first support device at a specific distance. An end of the second support device is connected to the board. Another end of the second support device is connected to the cap. The first link member has a first end portion and a second end portion. The first end portion is movably connected to the first support device. The second end portion is connected to the second support device.

Abstract: A distributed feedback (DFB) laser array includes a substrate, a semiconductor stacked structure, a first electrode layer, and a second electrode layer. The semiconductor stacked structure is formed above a surface of the substrate and includes two light-emitting modules and a tunnel junction. Each light-emitting module of the two light-emitting modules includes an active layer, a first cladding layer, and a second cladding layer. The active layer is installed between the first cladding layer and the second cladding layer, and the active layer has multiple lasing spots along a first direction, wherein the multiple lasing spots are used for generating multiple lasers. The tunnel junction is installed between the two light-emitting modules. The first electrode layer is formed above the semiconductor stacked structure. The second electrode layer is formed above another surface of the substrate.

Abstract: An auxiliary prediction system is provided to predict reliability of an object after a specific operation is applied to the target object. The auxiliary prediction system includes an image correction module and an analysis module. The image correction module performs an image correction procedure to convert an original image of the target object into a first correction image. The analysis module performs a feature analysis on the first correction image through an artificial intelligence model that has been trained, so as to predict whether the target object has a defect or not after the specific operation.

Abstract: A head band; and a pair of earmuffs being respectively mounted on two ends of the head band, each of the earmuffs has a speaker and a cushion. The cushion has an annular elastic portion protruded from a peripheral of the cushion and a chamber is surrounded by the annular elastic portion. The speaker has a back housing. A circuit board mounted to the back housing. A connector mounted on the circuit board. A speaker unit mounted to the back housing. A front housing covers the speaker unit and is assembled with the back housing. An opening penetrated through the front housing. A pressure sensor is disposing in the opening. A flexible circuit board connected between the pressure sensor and the connector of the circuit board. The cushion attached to the front housing. The pressure sensor is located in the chamber.

Abstract: A sheet metal hemming device is provided. The sheet metal hemming device includes a frame and a rolling wheel, a bearing wheel, a first rotating shaft, a second rotating shaft, a sliding block, an arc-shaped guide rail and a driver which are disposed on the frame. The rolling wheel is disposed on the first rotating shaft, the bearing wheel is disposed on the second rotating shaft, and an angle is formed between the rolling wheel and the bearing wheel. The sliding block is slidable relative to the arc-shaped guide rail and is connected to the rolling wheel via the first rotating shaft. The driver is connected to the sliding block for driving the sliding block to slide along the arc-shaped guide rail to adjust the angle between the rolling wheel and the bearing wheel.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: An ultrasonic cutter includes a tool holder and an ultrasonic oscillator. The tool holder has a lower circular air-out aisle defined by sleeving an inner ring and an outer ring. The inner ring has oppositely a first surface and a second surface, and the outer ring has oppositely a third surface and a fourth surface. A gap spacing the first surface from the third surface has an upper air inlet and a lower air outlet. The second surface has a lower inner inclined surface forming a first angle with the first surface. The fourth surface has an outer inclined surface forming a second angle with the third surface. The ultrasonic oscillator, disposed in a chamber of the tool holder spatially connected with the gap, is used for providing ultrasonic oscillation to a cutter. In addition, a cooling and chip diversion system for the ultrasonic cutter is also provided.

Abstract: A sheet metal hemming device is provided. The sheet metal hemming device includes a frame and a rolling wheel, a bearing wheel, a first rotating shaft, a second rotating shaft, a sliding block, an arc-shaped guide rail and a driver which are disposed on the frame. The rolling wheel is disposed on the first rotating shaft, the bearing wheel is disposed on the second rotating shaft, and an angle is formed between the rolling wheel and the bearing wheel. The sliding block is slidable relative to the arc-shaped guide rail and is connected to the rolling wheel via the first rotating shaft. The driver is connected to the sliding block for driving the sliding block to slide along the arc-shaped guide rail to adjust the angle between the rolling wheel and the bearing wheel.

Abstract: A distributed feedback (DFB) laser array includes a substrate, a semiconductor stacked structure, a first electrode layer, and a second electrode layer. The semiconductor stacked structure is formed above a surface of the substrate and includes two light-emitting modules and a tunnel junction. Each light-emitting module of the two light-emitting modules includes an active layer, a first cladding layer, and a second cladding layer. The active layer is installed between the first cladding layer and the second cladding layer, and the active layer has multiple lasing spots along a first direction, wherein the multiple lasing spots are used for generating multiple lasers. The tunnel junction is installed between the two light-emitting modules. The first electrode layer is formed above the semiconductor stacked structure. The second electrode layer is formed above another surface of the substrate.

Abstract: An automatic circuit board test system includes at least one switch module of board under test connected with a test board, a control module and a test process module. The test board includes a first signal interface, a second signal interface and a third signal interface and a repeater. The second signal interface and the third signal interface are mutually connected by a signal cable. The first signal interface is connected with the repeater. The at least one switch module of board under test is connected with the second signal interface and the third signal interface. The control module is connected with the at least one switch module of board under test. The control module controls the at least one switch module of board under test. The test process module is connected with the control module and the first signal interface by at least two serial port buses.

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.

Abstract: A keyswitch includes a board, a cap opposite to the board, a first support device, a second support device, and a first link member. The first support device is disposed between the cap and the board. An end of the first support device is connected to the board. Another end of the first support device is connected to the cap. The second support device is disposed between the cap and the board and is separate from the first support device at a specific distance. An end of the second support device is connected to the board. Another end of the second support device is connected to the cap. The first link member has a first end portion and a second end portion. The first end portion is movably connected to the first support device. The second end portion is connected to the second support device.

Abstract: An automatic circuit board test system includes at least one switch module of board under test connected with a test board, a control module and a test process module. The test board includes a first signal interface, a second signal interface and a third signal interface and a repeater. The second signal interface and the third signal interface are mutually connected by a signal cable. The first signal interface is connected with the repeater. The at least one switch module of board under test is connected with the second signal interface and the third signal interface. The control module is connected with the at least one switch module of board under test. The control module controls the at least one switch module of board under test. The test process module is connected with the control module and the first signal interface by at least two serial port buses.