Abstract: Aspects of the subject technology provide for secure, privacy-preserving access to electronic conferencing. In one or more implementations, participant devices in a conferencing session may be provided with the ability to expel one or more other participant devices from the conferencing session, even when the participant device(s) are not hosts or cohosts of the conferencing session. A participant device may be expellable by another participant device based on a connection mechanism by which the participant device is connected to the conferencing session, and/or based on an amount of time since the participant device joined the conferencing session.

Abstract: Participant systems in an audiovisual (AV) conferencing can, in one embodiment, use methods to ensure that all participants have a common platform to support AV conferencing, such as a common codec, and also attempt to provide higher quality AV conferencing (e.g., better than the common codec) based on available bandwidth and other criteria. The participant systems can use the common codec as a fallback platform when bandwidth or other criteria dictate a reduction in the quality of the AV conferencing. Other embodiments are also disclosed.

Abstract: The present disclosure generally relates to synchronizing copies of a data object.

Abstract: A device implementing a system for multipath connection management may include first and second local communication interfaces, and a processor configured to establish a primary connection for communicating between the first local communication interface and a first remote communication interface of an other device, and a secondary connection for communicating between the second local communication interface and a second remote communication interface. The processor may be configured to transmit application and control data over the primary connection and concurrently transmit a copy of control data over the secondary connection. The processor may be configured to determine that a degradation of the quality of the primary connection is attributable to the other device. The processor may be configured to switch the secondary connection to the first local communication interface and the second remote communication interface.

Abstract: Participant systems in an audiovisual (AV) conferencing can, in one embodiment, use methods to ensure that all participants have a common platform to support AV conferencing, such as a common codec, and also attempt to provide higher quality AV conferencing (e.g., better than the common codec) based on available bandwidth and other criteria. The participant systems can use the common codec as a fallback platform when bandwidth or other criteria dictate a reduction in the quality of the AV conferencing. Other embodiments are also disclosed.

Abstract: The present disclosure generally relates to synchronizing copies of a data object.

Abstract: The present disclosure generally relates to synchronizing copies of a data object.

Abstract: A device implementing a system for multipath connection management may include first and second local communication interfaces, and a processor configured to establish a primary connection for communicating between the first local communication interface and a first remote communication interface of an other device, and a secondary connection for communicating between the second local communication interface and a second remote communication interface. The processor may be configured to transmit application and control data over the primary connection and concurrently transmit a copy of control data over the secondary connection. The processor may be configured to determine that a degradation of the quality of the primary connection is attributable to the other device. The processor may be configured to switch the secondary connection to the first local communication interface and the second remote communication interface.

Abstract: A method and apparatus of a device that manages a video stream is described. In an exemplary embodiment, the device receives a plurality of packets for a video stream from a transmitting device via a server. The device may additionally store a first packet of the plurality of packets in a first buffer when the first packet is on-time and store a second packet of the plurality of packets in a second buffer when the second packet is late. The device may also further forward a frame from the second buffer to the first buffer when frame is complete.

Abstract: A device implementing a system for multipath connection management may include first and second local communication interfaces, and a processor configured to establish a primary connection for communicating between the first local communication interface and a first remote communication interface of an other device, and a secondary connection for communicating between the second local communication interface and a second remote communication interface. The processor may be configured to transmit application and control data over the primary connection and concurrently transmit a copy of control data over the secondary connection. The processor may be configured to determine that a degradation of the quality of the primary connection is attributable to the other device. The processor may be configured to switch the secondary connection to the first local communication interface and the second remote communication interface.

Abstract: Participant systems in an audiovisual (AV) conferencing can, in one embodiment, use methods to ensure that all participants have a common platform to support AV conferencing, such as a common codec, and also attempt to provide higher quality AV conferencing (e.g., better than the common codec) based on available bandwidth and other criteria. The participant systems can use the common codec as a fallback platform when bandwidth or other criteria dictate a reduction in the quality of the AV conferencing. Other embodiments are also disclosed.

Abstract: Aspects of the subject technology provide for secure, privacy-preserving access to electronic conferencing. In one or more implementations, participant devices in a conferencing session may be provided with the ability to expel one or more other participant devices from the conferencing session, even when the participant device(s) are not hosts or cohosts of the conferencing session. A participant device may be expellable by another participant device based on a connection mechanism by which the participant device is connected to the conferencing session, and/or based on an amount of time since the participant device joined the conferencing session.

Abstract: A device implementing a system for multipath connection management may include first and second local communication interfaces, and a processor configured to establish a primary connection for communicating between the first local communication interface and a first remote communication interface of an other device, and a secondary connection for communicating between the second local communication interface and a second remote communication interface. The processor may be configured to transmit application and control data over the primary connection and concurrently transmit a copy of control data over the secondary connection. The processor may be configured to determine that a degradation of the quality of the primary connection is attributable to the other device. The processor may be configured to switch the secondary connection to the first local communication interface and the second remote communication interface.

Abstract: A method of dissipating heat, packaging and shaping for light emitting diodes enhances the heat dissipation performance of light emitting diodes, and its structure includes a substrate and a light emitting diode chip. An antioxidation is performed at a high temperature at a predetermined position for installing a chip on the surface of the substrate; a layer of intermetallic layer is coated; a solder material is placed on the intermetallic layer and at the predetermined position of the chip; an intermetallic layer is also coated onto the adhering surface of the chip; the adhering surface of the chip is coupled with the solder material; meanwhile the intermetallic layer and the solder material are heated by furnace to form a stable metal alloy structure, so that the chip can be fixed onto the substrate; and finally the light emitting diode structure is completed by a wirebond process.